| Specifications |
| Overall Size |
2.25" x 1.50" (57 x 38 mm) |
| Adhesive |
B-staged modified acrylic film adhesive .002" (.051 mm) thick. |
| Bonding Temperature |
475°F +/- 25°F (246°C +/- 14°C) |
| Bonding Time |
30 seconds |
| Peel Strength |
Minimum 8 lbs/inch (1.43 kg/cm) after cure to FR-4 material. |
| Shelf Life |
1 year minimum. |
| REACH |
CircuitMedic Bonding Film contains less than 0.1% by weight for any substance listed as a very high concern in REACH. |
| Outgassing |
CircuitMedic Bonding Film consistently meets the criteria for NASA applications. Maximum 1.0% TML and a Maximum 0.10% CVCM. Samples have been submitted for testing to Goddard Space Flight Center and other facilities, and the results are; Data Reference: GSC 17366; %TML: 0.94%; %CVCM: 0.06% |
