First-Aid Kits for Circuit Boards ®
Newsletter | Ordering | Login
Phone: 978-373-1600
  
Reworking Internal Connection at a Via Hole More Features
  • Step 1. From the primary side we completely drill out the plating in the via hole to isolate the hole from layer 9 while, but leave the perimeter of the surface pad and the connection to the surface pad intact.
  • Step 2. On secondary side we perform a control depth mill drill to expose the layer 15 ground plane. You can see the ground layer as a crescent shape in the photo.
  • Step 3. On secondary side solder we solder a wire to the exposed layer 15 and route the wire through the circuit board.
  • Step 4. We solder the opposite end of the wire to the via pad on the primary side.
  • Step 5. On the secondary we side fill and seal the exposed plane and attached wire connection using high strength epoxy tinted with a color agent.
  • Step 6. On the primary side we fill and seal the attached wire connection using high strength epoxy tinted with a color agent.
This procedure was used to modify a batch of circuit boards that had a signal error at a via hole location. A via hole on this multilayer circuit board was mistakenly connected to layer nine when it should have been connected to layer 15.

This is genuine micro-surgery, but in the hands of skilled and trained technicians, it can be done with neatly and reliably.

Here is how we do it.
  1. From the primary side we completely drill out the plating in the via hole to isolate the hole from layer 9 while, but leave the perimeter of the surface pad and the connection to the surface pad intact.
  2. On secondary side we perform a control depth mill drill to expose the layer 15 ground plane. You can see the ground layer as a crescent shape in the photo.
  3. On secondary side solder we solder a wire to the exposed layer 15 and route the wire through the circuit board.
  4. We solder the opposite end of the wire to the via pad on the primary side.
  5. On the secondary we side fill and seal the exposed plane and attached wire connection using high strength epoxy tinted with a color agent.
  6. On the primary side we fill and seal the attached wire connection using high strength epoxy tinted with a color agent.
This would a very challenging, if not impossible task for most, but not for the properly equipped and skilled technicians. Another hearty handshake and a pat on the back to the super techs at Circuit Technology Center.
Several members of the Circuit Technology Center team contributed to this feature story.
The Toughest Component Rework?
The Toughest Component Rework?
Rework of surface mount and through hole components can be a challenge. Our techs are ready to tackle your toughest rework projects.
Learn more ...
Challenging Surface Mount Pad Repair
Challenging Surface Mount Pad Repair
Surface mount and BGA pad repair are routine operations at Circuit Technology Center. Learn how it's done with absolute precision and reliably.
Learn more ...
BGA Component Rework Simplified
BGA Component Rework Simplified
When you have tough BGA rework, where do you turn to? Discover the nation's #1 contractor for outsourced BGA rework, repair and reballing.
Learn more ...
Can You Repair a Broken Corner?
Can You Repair a Broken Corner?
What happens to an assembled circuit board with a broken corner? Can it be repaired reliably? It can if you have the training and the experience.
Learn more ...
ipc-logo Circuit Technology Center has been an IPC member since 1986
Circuit Technology Center Logo
Surgeon grade rework and repair,
by the book and guaranteed. ®