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Large Voids are Hard to Fill Just last week a customer of ours was in a tough bind regarding defective plating. They manufactured a massive backplane over four feet long and two feet wide. The board is nearly one half inch thick and plated throughout with gold. These boards are extremely expensive and manufacturing them is a nerve racking experience. Scrapping the boards out due to minor problems is demoralizing, not to mention the fact that if you scrap enough of them and you might just be looking for employment somewhere else. These boards contain thousands of surface mount pads and inevitably there are be one or two, here and there that have issues. On occasion the issues are very deep voids, canyons or crevices (thousandths of an inch deep due to the heavy copper used on the board surface) in the pads. See Figure 1.
There are a number of methods of handling voids in plating surfaces: Plate over the void leaving the indentation but covering the underlying metal with the desired surface finish. Depending on where the void is, how big it is and your acceptability criteria this can be all it takes to bring the board to an acceptable condition. On the other hand, if the void is too big or in a critical area, this approach may not be acceptable. Burnish or move the soft surface gold into the void, then touch up the burnished area with selective plating to improve the cosmetics. For slightly larger voids it may be possible to "blend" the void so that it is difficult to know there was even a defect in the first place. Conversely, if the hole is too deep or too wide it is difficult to bridge the gap without completely deforming the surface of the contact, perhaps making the contact look "smushed". Some voids are so large, they just are not fillable using this method, If the above methods won't work a decision may be made to replace the entire contact. After the general conversations, we were finally able to see the board and frankly we were a discouraged at first. In this case, as you can see by the photo, these are deep voids. Plating over the exposed copper and burnishing these large craters are not acceptable fixes. Unfortunately, on top of those restrictions, the customer could not allow a replacement contact. That left us scratching our heads. That's when we contacted Mike Amero of Creative Materials and discussed a number of potential conductive pastes that would be able to fill the void, adhere, not shrink, leave no voids due to outgassing, take the over-plate and then endure a soldering step. He presented a few good alternatives and then we went to work.
The basic repair procedure was to carefully apply the material using a microscope and a specially honed tip in order to ensure there were no voids left in the hole or at the edges of the metal as it fell off into the void. Next the material was cured. The excess material was carefully removed with another custom tool and the surface of the fill material was burnished smooth and even with the surface of the contact then plated. The results were impressive to look at and the repair went through reflow and testing without incident. See Figure 2. Happily we now have a new "Gold Standard" for large void repair. Several members of the Circuit Technology Center team contributed to this feature story. |
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CircuitMedic