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Any repair would have to endure the mechanical stress of insertion, plus the thermal stress of soldering temperatures when the component was soldered back into the circuit board.
The center of the pin base was machined to a depth of .050" (1.27 mm) leaving a thin wall around the circumference of the pin base. This machined opening was tinned with high temperature solder. The stub remaining on the component was also tinned with high temperature solder. A support fixture was fabricated by drilling clearance holes in a piece of laminate following the pin pattern. Us the fixture to precisely positing the replacement pin, it was soldered onto the component using a hot plate, flux, high temperature solder and a hot air rework system. The final step was to add a small bead of high strength epoxy around the rework area.
Several members of the Circuit Technology Center team contributed to this feature story. |
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