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2.0 Basic Procedures

Proprietary Information
This procedure contains proprietary information. The information is in a password protected folder for access by Circuit Technology Center, Inc. employees only.
2.0 Basic Procedures
List of procedures covering handling, cleaning, coating removal, coating replacement, solder mask repair, baking, preheating, legend, marking, and epoxy mixing.
2.1 Handling Electronic Assemblies
Procedure covering including electrostatic discharge (ESD),
electrical overstress (EOS), ESD/EOS safe work areas and handling and storage methods.
2.2 Cleaning
Procedure covers local cleaning and cleaning using an aqueous batch process for circuit boards.
2.2.1 Cleaning, Local
Procedure covers local cleaning for circuit boards.
2.2.2 Cleaning, Aqueous Batch Process
Procedure covers cleaning using an aqueous batch process for circuit boards.
2.3.1 Coating Removal, Identification of Coating
This procedure covers the techniques for identifying various coatings so that the appropriate coating removal method can be selected.
2.3.2 Coating Removal, Solvent Method
Procedure covers the methods for removal of coatings on circuit boards.
2.3.3 Coating Removal, Peeling Method
Procedure covers the methods for removal of coatings on circuit boards.
2.3.4 Coating Removal, Thermal Method
Procedure covers the methods for removal of coatings on circuit boards.
2.3.5 Coating Removal, Grinding/Scraping Method
Procedure covers the methods for removal of coatings on circuit boards.
2.3.6 Coating Removal, Micro Blasting Method
Procedure covers the methods for removal of coatings on circuit boards.
2.4.1 Coating Replacement, Solder Mask
Procedure covers the methods for replacement of coatings and solder mask on circuit boards.
2.4.2 Coating Replacement, Conformal Coating, Encapsulant
Procedure covers the methods for replacement of coatings and solder mask on circuit boards.
2.4.3 Coating Replacement, Solder Mask, BGA Locations
Procedure covers the methods for replacement of coatings and solder mask on circuit boards.
2.5 Baking and Preheating
Procedure covers baking and heating of circuit boards.
2.6.1 Legend/Marking, Stamping Method
Procedure covers the methods for repair and replacement of legend and markings on circuit boards.
2.6.2 Legend Marking, Hand Lettering Method
Procedure covers the methods for repair and replacement of legend and markings on circuit boards.
2.6.3 Legend Marking, Stencil Method
Procedure covers the methods for repair and replacement of legend and markings on circuit boards.
2.7 Epoxy Mixing and Handling
Procedures covering method for epoxy mixing for work on circuit boards.
Procedure for reference only.
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