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2.0 Basic Procedures

2.0 Basic Procedures
List of procedures covering handling, cleaning, coating removal, coating replacement, solder mask repair, baking, preheating, legend, marking, and epoxy mixing.
2.1 Handling Electronic Assemblies
Procedure covering including electrostatic discharge (ESD),
electrical overstress (EOS), ESD/EOS safe work areas and handling and storage methods.
2.2 Cleaning
Procedure covers local cleaning and cleaning using an aqueous batch process for circuit boards.
2.2.1 Cleaning, Local
Procedure covers local cleaning for circuit boards.
2.2.2 Cleaning, Aqueous Batch Process
Procedure covers cleaning using an aqueous batch process for circuit boards.
2.3.1 Coating Removal, Identification of Coating
This procedure covers the techniques for identifying various coatings so that the appropriate coating removal method can be selected.
2.3.2 Coating Removal, Solvent Method
Procedure covers the methods for removal of coatings on circuit boards.
2.3.3 Coating Removal, Peeling Method
Procedure covers the methods for removal of coatings on circuit boards.
2.3.4 Coating Removal, Thermal Method
Procedure covers the methods for removal of coatings on circuit boards.
2.3.5 Coating Removal, Grinding/Scraping Method
Procedure covers the methods for removal of coatings on circuit boards.
2.3.6 Coating Removal, Micro Blasting Method
Procedure covers the methods for removal of coatings on circuit boards.
2.4.1 Coating Replacement, Solder Mask
Procedure covers the methods for replacement of coatings and solder mask on circuit boards.
2.4.2 Coating Replacement, Conformal Coating, Encapsulant
Procedure covers the methods for replacement of coatings and solder mask on circuit boards.
2.4.3 Coating Replacement, Solder Mask, BGA Locations
Procedure covers the methods for replacement of coatings and solder mask on circuit boards.
2.5 Baking and Preheating
Procedure covers baking and heating of circuit boards.
2.6.1 Legend/Marking, Stamping Method
Procedure covers the methods for repair and replacement of legend and markings on circuit boards.
2.6.2 Legend Marking, Hand Lettering Method
Procedure covers the methods for repair and replacement of legend and markings on circuit boards.
2.6.3 Legend Marking, Stencil Method
Procedure covers the methods for repair and replacement of legend and markings on circuit boards.
2.7 Epoxy Mixing and Handling
Procedures covering method for epoxy mixing for work on circuit boards.
Procedure for reference only.
Six Fast Fixes for Circuit Boards
Six Fast Fixes for Circuit Boards
Use this versatile kit to fix damaged SMT pads, lands, gold edge contacts, conductors, plated holes and base board. It's the total package.
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6 Common Mistakes of BGA Rework
6 Common Mistakes of BGA Rework
BGA rework is one of the most challenging rework procedures. Doing it right depends in large part on the skills and knowledge of the rework technician.
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Circuitry/PTH Repair on Multilayer PCBs
Circuitry/PTH Repair on Multilayer PCBs
Learn about services to repair severe damage to conductors and plated holes, including damaged holes in multilayer PCBs.
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Perfect Kit for Replating Gold Contacts
Perfect Kit for Replating Gold Contacts
There's simply no reason to scrap circuit boards when they have contacts contaminated with solder. Restore them using the Gold Contact Plating Kit.
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