2.0 Basic Procedures

2.1 Handling Electronic Assemblies
Covers the proper methods for safe handling of circuit boards assemblies.

2.2.1 Cleaning, Local
Covers localized cleaning of circuit board assemblies using a solvent.

2.2.2 Cleaning, Aqueous Batch Process
Covers cleaning circuit board assemblies using an aqueous batch process.

2.3.1 Coating Removal, Identification of Coating
Covers methods to identify circuit board coatings and how to remove them.

2.3.2 Coating Removal, Solvent
Covers methods for coating and solder mask removal on printed circuit boards.

2.3.3 Coating Removal, Peeling
Covers removal of coatings on printed circuit boards by peeling.

2.3.4 Coating Removal, Thermal
Covers removal of coating from printed circuit boards using heat.

2.3.5 Coating Removal, Grinding/Scraping
Covers use of various grinding and scraping tools to remove coatings.

2.3.6 Coating Removal, Micro Blasting
Covers use of a micro abrasive blasting system to remove coatings.

2.4.1 Coating Replacement, Solder Mask
Covers methods to replace solder mask.

2.4.3 Coating Replacement, Solder Mask, BGA Locations
Procedure covers methods to replace solder mask at BGA locations.

2.5 Baking and Preheating
Covers baking and preheating of circuit boards.

2.6.1 Legend/Marking, Stamping
Covers methods to repair legend using a stamp.

2.6.2 Legend Marking, Hand Lettering
Covers methods to repair or add legend by hand lettering.

2.6.3 Legend Marking, Stencil
Covers methods to repair or add legend using a stencil.

2.7 Epoxy Mixing and Handling
Covers how to properly mixing and handling epoxy used through these guides.