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3.0 Base Board Procedures

3.0 Base Board Procedures
List of procedures covering delamination and blister repair, bow and twist repair, repair of non-plated holes and slots and base board repair on circuit boards.
3.1 Delamination/Blister Repair, Injection Method
Procedures covering delamination and blister repair on circuit boards.
3.2 Bow and Twist Repair
Procedures covering bow and twist repair on circuit boards.
3.3.1 Hole Repair, Epoxy Method
Procedures covers repair of non-plated holes on circuit boards.
3.3.2 Hole Repair, Transplant Method
Procedures covers repair of non-plated holes on circuit boards.
3.4.1 Key and Slot Repair, Epoxy Method
Procedure covers repair of slots on circuit boards.
3.4.2 Key and Slot Repair, Transplant Method
Procedure covers repair of slots on circuit boards.
3.5.1 Base Material Repair, Epoxy Method
Procedure covers repair of damaged base board on circuit boards.
3.5.2 Base Material Repair, Area Transplant Method
Procedure covers repair of damaged base board on circuit boards.
3.5.3 Base Material Repair, Edge Transplant Method
Procedure covers repair of damaged base board on circuit boards.
Procedure for reference only.
A Simple Fix for Damaged Conductors
A Simple Fix for Damaged Conductors
There is a quick and reliable IPC recommended repair for damaged conductors. The replacement conductor matches the original. Discover the secret.
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Tough Engineering Changes?
Tough Engineering Changes?
Engineering changes are a reality that need to be dealt with. Do you have qualified rework technicians to do the job efficiently and reliably?
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Epoxy Packs Eliminate Measuring
Epoxy Packs Eliminate Measuring
This unique kit contains 10 packages of super strength epoxy, precisely measured out into two-compartment plastic packages.
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87 Repair/Rework Guides Free Online
87 Repair/Rework Guides Free Online
This free online guidebook, packed with detailed illustrations, will be helpful to anyone who needs to repair or rework circuit board assemblies.
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