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3.0 Base Board Procedures

3.0 Base Board Procedures
List of procedures covering delamination and blister repair, bow and twist repair, repair of non-plated holes and slots and base board repair on circuit boards.
3.1 Delamination/Blister Repair, Injection Method
Procedures covering delamination and blister repair on circuit boards.
3.2 Bow and Twist Repair
Procedures covering bow and twist repair on circuit boards.
3.3.1 Hole Repair, Epoxy Method
Procedures covers repair of non-plated holes on circuit boards.
3.3.2 Hole Repair, Transplant Method
Procedures covers repair of non-plated holes on circuit boards.
3.4.1 Key and Slot Repair, Epoxy Method
Procedure covers repair of slots on circuit boards.
3.4.2 Key and Slot Repair, Transplant Method
Procedure covers repair of slots on circuit boards.
3.5.1 Base Material Repair, Epoxy Method
Procedure covers repair of damaged base board on circuit boards.
3.5.2 Base Material Repair, Area Transplant Method
Procedure covers repair of damaged base board on circuit boards.
3.5.3 Base Material Repair, Edge Transplant Method
Procedure covers repair of damaged base board on circuit boards.
Procedure for reference only.
Keep This Plated-Hole Repair Kit Handy
Keep This Plated-Hole Repair Kit Handy
Plated holes in circuit boards are easily damaged. This kit includes all the tools and materials needed to repair damaged plated through holes.
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Are Your BGA Rework Techs Competent?
Are Your BGA Rework Techs Competent?
Can every operator handle your BGA rework equally well? In real life, in all but just a few situations, the answer is no. Why is this so?
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Jumper Wire Hassles Eliminated
Jumper Wire Hassles Eliminated
Throw away that super glue and eliminate that super glue mess. Clean up your act when bonding wires. Wire Dots make the job clean, neat and fast.
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11 Rules for Circuit Board Mods
11 Rules for Circuit Board Mods
Some of the odd twists and turns occasionally needed to modify assembled circuit boards can be surprising. Discover the 11 rules your techs should know.
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