CircuitMedic
First-Aid Kits for Circuit Boards
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3.0 Base Board Procedures
3.1 Delamination/Blister Repair
 3.1 Delamination/Blister Repair
Covers repair of blisters in circuit board base materials.
3.2 Bow and Twist Repair
 3.2 Bow and Twist Repair
Covers how to reduce the bow and twist, or warping of circuit boards.
3.3.1 Hole Repair, Epoxy
 3.3.1 Hole Repair, Epoxy
Covers how to repair minor damage to non-plated holes.
3.3.2 Hole Repair, Transplant
 3.3.2 Hole Repair, Transplant
Covers how to repair major damage to non-plated holes.
3.4.1 Key and Slot Repair, Epoxy
 3.4.1 Key and Slot Repair, Epoxy
Covers how to repair minor damage to key & slot openings.
3.4.2 Key and Slot Repair, Transplant
 3.4.2 Key and Slot Repair, Transplant
Covers how to repair major damage to key & slot openings.
3.5.1 Base Material Repair, Epoxy
 3.5.1 Base Material Repair, Epoxy
Covers how to repair minor damage to circuit base board material.
3.5.2 Base Material Repair, Area Transplant
 3.5.2 Base Material Repair, Area Transplant
Covers how to repair major damage to base board areas.
3.5.3 Base Material Repair, Edge Transplant Method
 3.5.3 Base Material Repair, Edge Transplant Method
Covers how to repair edge damage using a tongue and groove technique.
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CircuitMedic
22 Parkridge Road, Haverhill, MA 01835 USA
Phone: 978-373-1600 - Fax: 978-372-5700
Division of Circuit Technology Center, Inc.
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