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4.1.2 Lifted Conductor Repair, Film Adhesive Method
Outline
This method is used to repair damaged and lifted conductors. Dry film epoxy is used to rebond the lifted conductor.

Caution
This method should not be used to rebond a conductor that has been stretched or damaged.

Minimum Skill Level - Intermediate
Recommended for technicians with skills in basic soldering and component rework, but may be inexperienced in general repair/rework procedures.

Conformance Level - High
This procedure most closely duplicates the physical characteristics of the original, and most probably complies with all the functional, environmental and serviceability factors.

Acceptability References
IPC-A-600 2.0 Externally Observable Characteristics
IPC-A-610 10.0 Laminate Conditions
Procedure References
1.0 Foreword
2.1 Handling Electronic Assemblies
2.2 Cleaning
2.5 Baking And Preheating
IPC7721 4.1.2 Lifted Conductor Repair, Film Adhesive Method
Tools and Materials
CircuitMedic Part
Alcohol Swab
Self-saturating Isopropyl alcohol swab. Squeeze handle to release alcohol.
CircuitMedic Part
Bonding Film
Dry film adhesive used to bond lifted lands, pads and conductors.
CircuitMedic Part
Bonding Iron, 120 VAC
Delivers the optimal heat for curing adhesive bonding film.
CircuitMedic Part
Bonding System
System designed to repair lifted and damaged conductors, pads, BGA pads, SMT pads.
Soldering Iron
Bonding Tips
Used to cure adhesive backed circuit frames for pad, land and contact repair.
Cleaner
Cleaner
General purpose cleaner for removing contamination.
CircuitMedic Part
Cleaning Brushes
Disposable brushes for use with solvents for cleaning and application of coatings.
Color Agent
Color Agents
Use to tint the color of epoxy used for solder mask repair or circuit base board repair.
CircuitMedic Part
Circuit Bond Packs
Clear, superior strength epoxy in two-compartment plastic packages
CircuitMedic Part
High Temp Tape Discs
High temperature polyimide tape discs, .50" diameter.
CircuitMedic Part
Knife with #16 Blades
A must-have tool for precise cutting, scraping and trimming.
Microscope
Microscope
It is a challenge to undertake precision repair without a good microscope.
CircuitMedic Part
Micro Probes
Use to dispense a minute amount of adhesive and for micro-positioning of small objects.
CircuitMedic Part
Scraper
Hardened stainless steel tip for scraping solder mask and removing defects.
CircuitMedic Part
Tweezer, Point Tip
Fine point tweezers for precision work.
Wipes
Wipes
Nonabrasive, low-linting wipes for cleanup.
Images and Figures
4.1.2 Lifted Conductor Repair, Film Adhesive Method
Lifted Conductor
4.1.2 Lifted Conductor Repair, Film Adhesive Method
Figure 1: Cut out a piece of dry film epoxy and place it under the lifted conductor.
4.1.2 Lifted Conductor Repair, Film Adhesive Method
Figure 2: Place Kapton tape over the lifted conductor.
4.1.2 Lifted Conductor Repair, Film Adhesive Method
Figure 3: Bond the lifted conductor using a Bonding System.
4.1.2 Lifted Conductor Repair, Film Adhesive Method
Figure 4: Completed repair.

Procedure
  1. Clean the area.

  2. Remove any obstructions that prevent the lifted conductor from making contact with the base board surface.

    Caution
    Be careful while cleaning and removing all obstructions, not to stretch or damage the lifted conductor.

  3. Clean the area.

  4. Cut out a piece of dry film epoxy that closely matches the size of the lifted conductor. Be careful not to contaminate the dry film epoxy with materials that could reduce the bond strength. (See Figure 1)

    Note
    Dry film epoxy thickness should be selected to meet the requirements of the circuit Board.

  5. Place the dry film epoxy under the lifted conductor. (See Figure 1)

  6. Select a bonding tip with a shape to match the shape of the lifted conductor.

    Note
    The bonding tip should be as small as possible but should completely cover the entire surface of the conductor.

  7. Place a piece of High Temperature Tape over the lifted conductor. (See Figure 2)

  8. Position the circuit board so that it is flat and stable. Gently place the hot bonding tip onto the tape covering the new conductor. Apply pressure as recommended in the manual of the repair system or repair kit for 5 seconds to tack the conductor in place. Carefully peel off the tape.

  9. Gently place the bonding tip directly onto the new conductor. Apply pressure as recommended in the manual of the repair system or repair kit for an additional 30 seconds to fully bond the conductor. The conductor is fully cured. Carefully clean the area and inspect the new conductor.

  10. Replace surface coating to match prior coating as required.

Evaluation

  1. Visual examination and tape test per IPC-TM-650 (ANCI/IPC-FC-250A) test method 2.4.1.

  2. Electrical tests as applicable.

Procedure for reference only.