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4.2.5 Conductor Repair, Through Board Wire Method

  • This method is used on circuit boards to replace damaged or missing circuits on the circuit board surface. A length of standard insulated or non insulated wire is used to repair the damaged circuit.
  • Scrape off any solder mask or coating from the ends of the remaining circuits.
  • Drill through the board adjacent to both ends of the remaining circuits.
  • Bend the stripped wire over the prepared circuits in line with the circuits.
  • Lap solder the wire to the circuits on the circuit board surface.
Outline
This method is used on circuit boards to replace damaged or missing circuits on the circuit board surface. A length of standard insulated or non insulated wire is used to repair the damaged circuit.

Caution
The circuit widths, spacing and current carrying capacity must not be reduced below allowable tolerances.

Caution
This method is not allowed when wire will be subsequently subjected to a mass soldering operation.

Proprietary Information Proprietary
This guide may contain proprietary or copyright-protected information for access by authorized persons only.

Minimum Skill Level - Advanced
Recommended for technicians with soldering and component rework skills and exposure to most repair/rework procedures, but lacking extensive experience.

Conformance Level - Medium
This procedure may have some variance with the physical character of the original and most likely varies with some of the functional, environmental and serviceability factors.

Acceptability References
IPC-A-610 11.0 Discrete Wiring  Proprietary
Procedure References
1.0 Foreword
2.1 Handling Electronic Assemblies
2.2 Cleaning
2.5 Baking And Preheating
2.7 Epoxy Mixing and Handling
IPC7721 4.2.5 Conductor Repair, Through Board Wire Method  Proprietary
Tools and Materials
CircuitMedic Part
Alcohol Swab
Self-saturating Isopropyl alcohol swab. Squeeze handle to release alcohol.
CircuitMedic Part
Ball Mills, Abrasives, Cutting Tools
Ball mills, abrasives and cutting tools for working on circuit boards.
Cleaner
Cleaner
General purpose cleaner for removing contamination.
CircuitMedic Part
Cleaning Brushes
Disposable brushes for use with solvents for cleaning and application of coatings.
CircuitMedic Part
Knife with #16 Blades
A must-have tool for precise cutting, scraping and trimming.
Microscope
Microscope
Precision microscope with stand and lighting for work and inspection.
CircuitMedic Part
Micro Drill System
Versatile power tool for milling, drilling, grinding, cutting and sanding circuit boards.
Solderinmg Iron
Soldering Iron
Properly maintained soldering iron and properly sized soldering iron tips.
Wipes
Wipes
Nonabrasive, low-linting wipes for cleanup.
Wire
Wire
Solid conductor wire for conductor repair and jumpers.
CircuitMedic Part
Wire Dots
Pre-cut polymer film tape with a high performance adhesive designed for tacking wires.
CircuitMedic Part
Wire Guide
Use to form bends in wires and hold wires during soldering and bonding.
Wire Stripper
Wire Stripper
Sharp wire strippers for stripping insulated wire.
Images and Figures
4.2.5 Conductor Repair, Through Board Wire Method
Damaged Conductor
4.2.5 Conductor Repair, Through Board Wire Method
Figure 1: Scrape off any solder mask or coating from the ends of the remaining circuits.
4.2.5 Conductor Repair, Through Board Wire Method
Figure 2: Drill through the board adjacent to both ends of the remaining circuits.

4.2.5 Conductor Repair, Through Board Wire Method
Figure 3: Bend the stripped wire over the prepared circuits in line with the circuits.
4.2.5 Conductor Repair, Through Board Wire Method
Figure 4: Lap solder the wire to the circuits on the circuit board surface.
Procedure
  1. Clean the area.
  2. Remove the damaged section of circuit using the knife. The damaged circuit should be trimmed back to a point where the circuit still has a good bond to the PC board surface.

    Note
    Heat can be applied to the damaged circuit using a soldering iron to allow the circuit to be removed more easily.
  3. Use a knife and scrape off any solder mask or coating from the ends of the remaining circuit. (See Figure 1)
  4. Remove all loose material. Clean the area.
  5. Apply a small amount of liquid flux to the ends of the remaining circuit. Tin the exposed end of each circuit using solder and a soldering iron.
  6. Clean the area.
  7. Select a wire to match the width and thickness of the circuit to be replaced. Cut a length approximately as needed. See Table 1 for Solid Wire Equivalents.

    Table 1 - Solid Wire Equivalents
    Conductor Width 2 oz. Copper Equivalent Solid Wire Diameter
    .010" (0.25 mm) #34, .006" (0.15 mm)
    .015" (0.38 mm) #32, .008" (0.20 mm)
    .020" (0.50 mm) #31, .009" (0.23 mm)
    .031" (0.78 mm) #29, .011" (0.28 mm)
    .082" (2.08 mm) #26, .018" (0.46 mm)
    .125" (3.18 mm) #23, .023" (0.58 mm)

    When using solid wire to repair a conductor, there should be no reduction in the cross sectional area.
  8. Strip the wire and tin the ends if needed. Non insulated wire may be used for short repairs if conductors are not crossed.
  9. Clean the wire.
  10. Drill through the board adjacent to both ends of the remaining circuits. Drill the hole slightly larger than the wire diameter to be used. (See Figure 2)

    Caution
    Review circuit diagrams to be sure no surface or internal circuits will be damaged or shorted.
  11. Position the wire on the opposite side from the repair and insert the stripped ends into the drilled holes.
  12. Bend the stripped wire over the prepared circuits in line with the circuits. The wire should overlap the existing circuit a minimum of 2 times the circuit width. (See Figure 3)

    Note
    If the configuration permits, the overlap solder joint connection should be a minimum of 3.00 mm (0.125") from the related termination. This gap will minimize the possibility of simultaneous reflow during soldering operations. Refer to 7.1 Soldering Basics.
  13. Apply a small amount of liquid flux to the overlap joint.
  14. Lap solder the wire to the circuits on the circuit board surface. Make sure the wire is properly aligned. (See Figure 4)
  15. Form the wire on the opposite side to match the shape of the missing circuit, if desired.
  16. Clean the area.

    Note
    It may be necessary to encapsulate the solder joint connection if electrical spacing is reduced.
  17. If desired bond the wire to the circuit board surface with adhesive, epoxy or Tape Dots. Refer to Section 6.0.

    Caution
    Some components may be sensitive to high temperature.
  18. Cure the epoxy per Procedure 2.7 Epoxy Mixing and Handling
  19. After the epoxy has cured clean the area.
Evaluation
  1. Visual examination for alignment and overlap of wire.
  2. Electrical tests as applicable.
Procedure for reference only.
 

Related Products

Wire Dots
Pre-cut polymer film tape with a high performance adhesive designed for tacking wires.
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