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5.0 Plated Hole Procedures
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5.1 Plated Hole Repair, No Inner Layer Connection
Procedure covers the repair of a damaged
hole that has no inner layer connection.
5.2 Plated Hole Repair, Double Wall Method
Procedure covers use of an eyelet for the repair
of a damaged pad on a hole with an inner layer connect.
5.3 Plated Hole Repair, Inner Layer Connection
Procedure uses an eyelet to repair a plated
through hole that has an inner layer connect.
Related Information
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Guide Book
0.0 Introduction
1.0 Foreword
2.0 Basic Procedures
3.0 Base Board Procedures
4.0 Conductor Procedures
5.0 Plated Hole Procedures
6.0 Wires/Component Mods
7.0 Soldering Procedures
8.0 Component Removal
9.0 BGA Comp. Rework
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