5.0 Plated Hole Procedures

Circuit Board Rework and Repair Guide

5.0 Plated Hole Procedures

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	5.1 Plated Hole Repair, No Inner Layer Connection Procedure covers the repair of a damaged hole that has no inner layer connection.
	5.2 Plated Hole Repair, Double Wall Method Procedure covers use of an eyelet for the repair of a damaged pad on a hole with an inner layer connect.
	5.3 Plated Hole Repair, Inner Layer Connection Procedure uses an eyelet to repair a plated through hole that has an inner layer connect.