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6.0 Jumper Wire and Component Modification Procedures

Proprietary Information
This procedure contains proprietary information. The information is in a password protected folder for access by Circuit Technology Center, Inc. employees only.
6.0 Jumper Wire and Component Modification Procedures
List of procedures covering jumper wires, modification procedures, engineering changes, and component lead cutting and lifting.
6.1 Jumper Wires
Procedure covering jumper wires on circuit boards.
6.2.1 Jumper Wires, BGA Components, Circuit Track Method
Procedure covering jumper wires on circuit boards.
6.2.2 Jumper Wires, BGA Components, Through Board Method
Procedure covering jumper wires on circuit boards.
6.3 Component Modifications and Additions
Procedure covering component modification and additions on circuit boards.
6.4 Component Lead Cutting and Lifting
Procedure covering component lead cutting and lifting on circuit boards.
Procedure for reference only.
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