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Master Repair Kit
Land/Pad Repair Kit
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Base Board Repair Kit
Gold Contact Plating Kit
Soldering Skills Practice Kit
Repair Skills Practice Kit
Eyelet Press System
Circuit Frame Index
BGA Rework Stencil Index
2.0 Basic Procedures
3.0 Base Board Procedures
4.0 Conductor Procedures
5.0 Plated Hole Procedures
6.0 Wires/Component Mods
7.0 Soldering Procedures
8.0 Component Removal
9.0 BGA Component Rework
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6.0 Jumper Wire and Component Modification Procedures
6.1 Jumper Wires
Procedure covers use of jumper wires including dozens of detailed illustrations and photographs.
6.2.1 Jumper Wires, BGA Components, Circuit Track Method
Procedure is used to change a circuit path at a BGA site for engineering changes or modifications.
6.2.2 Jumper Wires, BGA Components, Through Board Method
Procedure is used to add a jumper at a BGA site by running the jumper through a hole in the circuit board.
6.3 Component Modifications and Additions
Procedure covers the general guidelines for modifications that involve adding components.
6.4 Component Lead Cutting and Lifting
Procedure covers the general guidelines for for modifications that involve cutting and lifting component leads.
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