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6.0 Jumper Wire and Component Modification Procedures
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6.1 Jumper Wires
Procedure covers use of jumper wires
including 42 detailed illustrations and photographs.
6.2.1 Jumper Wires, BGA Components
Circuit Track Method
Procedure is used to change a circuit path at a
BGA site for engineering changes or modifications.
6.2.2 Jumper Wires, BGA Components
Through Board Method
Procedure is used to add a jumper at a BGA site by
running the jumper through a hole in the board.
6.3 Component Modifications and Additions
Procedure covers the general guidelines for
modifications that involve adding components.
6.4 Component Lead Cutting and Lifting
Procedure covers the general guidelines for
for modifications that involve cutting and lifting component leads.
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Guide Book
0.0 Introduction
1.0 Foreword
2.0 Basic Procedures
3.0 Base Board Procedures
4.0 Conductor Procedures
5.0 Plated Hole Procedures
6.0 Wires/Component Mods
7.0 Soldering Procedures
8.0 Component Removal
9.0 BGA Comp. Rework
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