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6.3 Component Modifications and Additions

Outline
This procedure covers the general guidelines for modifications that involve adding components.

Minimum Skill Level - Advanced
Recommended for technicians with soldering and component rework skills and exposure to most repair/rework procedures, but lacking extensive experience.

Procedure References
1.0 Foreword
2.1 Handling Electronic Assemblies
2.2 Cleaning
2.5 Baking And Preheating
2.7 Epoxy Mixing and Handling
6.1 Jumper Wires
Tools and Materials
Cleaner
Cleaner
General purpose cleaner for removing contamination.
Microscope
Microscope
Precision microscope with stand and lighting for work and inspection.
Solderinmg Iron
Soldering Iron, Solder and Flux
Properly maintained soldering iron, soldering iron tips, solder and flux.
Wipes
Wipes
Nonabrasive, low-linting wipes for cleanup.
Proprietary Information
This procedure contains proprietary information. The information is in a password protected folder for access by Circuit Technology Center, Inc. employees only.
General Rules
  1. Added components may need to be secured with adhesive, or by other means, if the component leads or component body would be subjected to mechanical stress.
  2. Leads of added components should not be inserted into plated holes occupied by another component lead.
  3. Added components placed on the circuit board surface should be placed on the component side of the assembly or circuit board unless otherwise specified.
  4. Added components shall not be raised above the board surface beyond allowable dimensions.
  5. Added components shall not cover over pads or vias used as test points.
  6. Added components shall not cover other component foot prints unless the layout of the assembly prohibits mounting in other areas.
  7. Added component leads may require insulation to avoid contact with component body or other conductors.
  8. Removal of existing solder from a connection point may be necessary to avoid bridging, or excess solder, in the final connection.
  9. Consider design limitations and product use environments when stacking components.
  10. Do not exceed minimum component lead bend radius.
  11. When possible, component identification marking shall be legible.
Procedure
  1. When required, form the component leads and clean the area.
  2. When required, secure the component in place by bending leads or other mechanical means.
  3. Apply flux to the joint.
  4. Place the soldering iron tip at the connection between both leads. Apply a small amount of solder at the connection of soldering iron tip and lead to form a solder bridge.
  5. Immediately feed solder into the joint from the side opposite from the soldering iron tip until the proper fillet is achieved. Remove the solder and iron simultaneously.
  6. When required, clean the flux residue.
  7. Inspect
Component Modifications and Additions Figures

figure
Figure 1: Radial lead component soldered to through hole component leads. Note: Leads of the radial component should not need to be inserted into the plated holes.
figure
Figure 2: Axial lead component soldered to through hole component leads. Note: Leads of axial component should not be inserted into the plated holes.
figure
Figure 3: Axial lead component soldered to adjacent axial lead component. Note: Added component may be stacked vertically or horizontally.
figure
Figure 4: Chip component soldered to surface mount component using jumper wires. Note: One lead of surface mount component is shown lifted.
figure
Figure 5: DIP component stacked and soldered onto another DIP component. One lead shown clipped. Note: Leads of added component should not be inserted into the plated holes.
figure
Figure 6: Chip cap bridging adjacent leads.
figure
Figure 7: Chip component bridging leads of surface mount component.
figure
Figure 8: Chip component stacked onto another chip component.
figure
Figure 9: Surface mount component mounted upside down with jumper wires attached. Note: One lead is bent outward.
figure
Figure 10: DIP Component mounted upside down with jumper wires attached.
figure
Figure 11: Chip component mounted to one pad only.
figure
Figure 12: Radial lead component mounted upside down. Note: Insulate leads to avoid contact with component body.
Procedure for reference only.
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