CircuitMedic
First-Aid Kits for Circuit Boards ®
About Us  |   Free Newsletter  |   Contact Us
Phone: 978-373-1600
7.4.1 Soldering Surface Mount J Lead Components Point To Point Method
Outline
This procedure covers the general guidelines for soldering surface mount J lead components. There is basically only one style of J lead component. Whether leads are on two sides or four sides, or whether the component is large or small, the soldering principles are the same.
Minimum Skill Level - Intermediate
Recommended for technicians with skills in basic soldering and component rework, but may be inexperienced in general repair/rework procedures.
Conformance Level - High
This procedure most closely duplicates the physical characteristics of the original, and most probably complies with all the functional, environmental and serviceability factors.
Acceptability References
IPC-A-610 12.0 Surface Mount Assemblies
Procedure References
1.0 Foreword
2.1 Handling Electronic Assemblies
2.2 Cleaning
2.5 Baking And Preheating
7.1.1 Soldering Basics
7.1.2 Preparation For Soldering And Component Removal
7.1.3 Solder Joint Acceptability Criteria
IPC7711 5.6.2 Point-To-Point-Method
Tools and Materials
Cleaner
Cleaner
General purpose cleaner for removing contamination.
Microscope
Microscope
It is a challenge to undertake precision repair without a good microscope.
Soldering Iron
Soldering Iron, Solder and Flux
A well maintained soldering iron is a must at every tech bench.
Wipes
Wipes
Nonabrasive, low-linting wipes for cleanup.
Images and Figures
7.4.1  Soldering Surface Mount J Lead Components Point To Point Method
Surface Mount J Lead Component
7.4.1  Soldering Surface Mount J Lead Components Point To Point Method
Figure 1: Place component and check alignment.
7.4.1  Soldering Surface Mount J Lead Components Point To Point Method
Figure 2: Place the soldering iron tip at the junction between the pad and component lead.
7.4.1  Soldering Surface Mount J Lead Components Point To Point Method
Figure 3:A - Dot indicates pin 1.B - Indicates pin 5.C - Indicates direction of pin count.
Procedure 
  1. Add liquid flux to the corner pads.

  2. Place the component in position and hold it steady. The leads must be aligned with the pads. On large components this is best done by aligning the leads on opposite corners. (See Figure 1).

  3. Place the soldering iron tip at the junction between the pad and component lead at one of the corners. Apply additional solder as needed. (See Figure 2).

  4. Remove the tip. Wait a moment for the solder to solidify before soldering the opposite corner.

  5. After the opposite corner is soldered, solder the remaining leads.

  6. Clean, if required and inspect.

This procedure is for reference only. Refer to the Procedure References listed above, or contact Circuit Technology Center for appropriate industry approved references.
Free Newsletter
The most valuable tool in your repair department is high quality information. Get a subscription to Circuit Rework News.

CircuitMedic
22 Parkridge Road, Haverhill, MA 01835 USA
Phone: 978-373-1600 - Fax: 978-372-5700
Division of Circuit Technology Center, Inc.
Copyright © 2014 All rights reserved.

ISO9000:2008 Certified
 
Member Since 1986