First-Aid Kits for Circuit Boards ®
Newsletter | Ordering | Login
Phone: 978-373-1600
  

7.5.3 Soldering Surface Mount Gull Wing Components, Hot Gas Method

  • This procedure covers the general guidelines for soldering surface mount Gull Wing components.
  • Add a small bead of solder paste along the row of pads.
  • Move the tool back and forth to heat all the solder joints until complete solder melt is observed.
Outline
This procedure covers the general guidelines for soldering surface mount Gull Wing components. There is basically only one type of Gull Wing component. Whether leads are on two sides or four sides, or whether the component is large or small, the soldering principles are the same.

Minimum Skill Level - Intermediate
Recommended for technicians with skills in basic soldering and component rework, but may be inexperienced in general repair/rework procedures.

Conformance Level - High
This procedure most closely duplicates the physical characteristics of the original, and most probably complies with all the functional, environmental and serviceability factors.

Acceptability References
IPC-A-610 12.0 Surface Mount Assemblies
Procedure References
1.0 Foreword
2.1 Handling Electronic Assemblies
2.2 Cleaning
2.5 Baking And Preheating
7.1.1 Soldering Basics
7.1.2 Preparation For Soldering And Component Removal
7.1.3 Solder Joint Acceptability Criteria
Tools and Materials
Images and Figures
7.5.3 Soldering Surface Mount Gull Wing Components, Hot Gas Method
Surface Mount Gull Wing Component
7.5.3 Soldering Surface Mount Gull Wing Components, Hot Gas Method
Figure 1: Add a small bead of solder paste along the row of pads.
7.5.3 Soldering Surface Mount Gull Wing Components, Hot Gas Method
Figure 2: Move the tool back and forth to heat all the solder joints until complete solder melt is observed.

Procedure
  1. Add a small bead of solder paste along the row of pads. (See Figure 1)
  2. Place the component in position.
  3. Adjust the pressure and temperature output of the hot air tool.
  4. Direct the hot air over the component with the hot air tool tip approximately 2.50 cm (1.00") from the solder joint. This initial heating will pre-dry the solder paste.

    Note
    Solder paste has a dull flat appearance when dried.
  5. When the solder paste has dried, move the hot air tool tip to approximately 0.50 cm (0.20") above the component. Move the tool back and forth to heat all the solder joints until complete solder melt is observed. (See Figure 2)
  6. Remove the tool. Wait a moment for the solder to solidify.
  7. Clean, if required and inspect.
Procedure for reference only.
Six Fast Fixes for Circuit Boards
Six Fast Fixes for Circuit Boards
Use this versatile kit to fix damaged SMT pads, lands, gold edge contacts, conductors, plated holes and base board. It's the total package.
Learn more ...
6 Common Mistakes of BGA Rework
6 Common Mistakes of BGA Rework
BGA rework is one of the most challenging rework procedures. Doing it right depends in large part on the skills and knowledge of the rework technician.
Learn more ...
Circuitry/PTH Repair on Multilayer PCBs
Circuitry/PTH Repair on Multilayer PCBs
Learn about services to repair severe damage to conductors and plated holes, including damaged holes in multilayer PCBs.
Learn more ...
Perfect Kit for Replating Gold Contacts
Perfect Kit for Replating Gold Contacts
There's simply no reason to scrap circuit boards when they have contacts contaminated with solder. Restore them using the Gold Contact Plating Kit.
Learn more ...
ipc-logo Circuit Technology Center has been an IPC member since 1986
Circuit Technology Center Logo
Surgeon grade rework and repair,
by the book and guaranteed. ®