First-Aid Kits for Circuit Boards
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7.5.3 Soldering Surface Mount Gull Wing Components Hot Gas Method
Outline
This procedure covers the general guidelines for soldering surface mount Gull Wing components. There is basically only one type of Gull Wing component. Whether leads are on two sides or four sides, or whether the component is large or small, the soldering principles are the same.
Minimum Skill Level - Intermediate
Recommended for technicians with skills in basic soldering and component rework, but may be inexperienced in general repair/rework procedures.
Conformance Level - High
This procedure most closely duplicates the physical characteristics of the original, and most probably complies with all the functional, environmental and serviceability factors.
| Acceptability References |
| IPC-A-610 12.0 |
Surface Mount Assemblies |
| Tools and Materials |
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Cleaner
General purpose cleaner for removing contamination. |
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Hot Air Tool
Tool and nozzles to deliver precise flow of hot air. |
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Microscope
It is a challenge to undertake precision repair without a good microscope. |
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Solder Paste
Solder paste for component soldering and rework. |
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Wipes
Nonabrasive, low-linting wipes for cleanup. |
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| Images and Figures |
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| Surface Mount Gull Wing Component |
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| Figure 1: Add a small bead of solder paste along the row of pads. |
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| Figure 2: Move the tool back and forth to heat all the solder joints until complete solder melt is observed. |
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Procedure
- Add a small bead of solder paste along the row of pads. (See Fig. 1).
- Place the component in position.
- Adjust the pressure and temperature output of the hot air tool.
- Direct the hot air over the component with the hot air tool tip
approximately 2.50 cm (1.00") from the solder joint. This initial heating will
pre-dry the solder paste.
Note
Solder paste has a dull flat
appearance when dried.
- When the solder paste has dried, move the hot air tool tip to approximately
0.50 cm (0.20") above the component. Move the tool back and forth to heat all
the solder joints until complete solder melt is observed. (See Figure 2).
- Remove the tool. Wait a moment for the solder to solidify.
- Clean, if required and inspect.
This procedure is for reference only. Refer to the Procedure References listed above, or contact Circuit Technology Center for appropriate industry approved references.
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CircuitMedic
22 Parkridge Road, Haverhill, MA 01835 USA
Phone: 978-373-1600 - Fax: 978-372-5700
Division of Circuit Technology Center, Inc.
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Member Since 1986
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