| 8.0 Rework Procedures |
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Printed Board Type: N/A
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8.1.1 Removal, Through Hole Vacuum
Method Covers through hole powered vacuum desoldering. 8.1.2 Removal, Through Hole, Solder
Fountain Covers through hole removal using solder
fountain. |
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8.2.1 Removal, Chip, Forked Tip Method
* Forked tip method for chip component removal. 8.2.2 Removal, Chip, Hot Tweezer Method
* Hot tweezer method for chip component removal. |
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8.3.1 Removal, J Lead, Conduction Method
* Contact method of J lead component removal. 8.3.2 Removal, J Lead Comp., Hot Gas Method
* Convection method of J lead component removal. |
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8.4.1 Removal, Gull Wing, Conduction
Method * Contact method of gull wing component removal. 8.4.2 Removal, Gull Wing, Hot Gas Method
* Convection method of gull wing component removal. |
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* Procedures include video clips
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