First-Aid Kits for Circuit Boards®
Phone: 978-373-1600
8.0 Rework Procedures

8.1.1 Component Removal, Through Hole Components, Vacuum Method
8.1.1 Component Removal, Through Hole Components, Vacuum Method
Procedure covers removal of through hole components using powered vacuum desoldering.
8.1.2 Component Removal, Through Hole Components, Solder Fountain Method
8.1.2 Component Removal, Through Hole Components, Solder Fountain Method
Procedure covers removal of through hole components using a solder fountain system.
8.2.1 Component Removal, Surface Mount Chip Components, Forked Tip Method
8.2.1 Component Removal, Surface Mount Chip Components, Forked Tip Method
Procedure covers removal of chip components using a forked tip tool.
8.2.2 Component Removal, Surface Mount Chip Components, Hot Tweezer Method
8.2.2 Component Removal, Surface Mount Chip Components, Hot Tweezer Method
Procedure covers removal of chip components using a hot tweezer tool.
8.3.1 Component Removal, Surface Mount J Lead Components, Conduction Method
8.3.1 Component Removal, Surface Mount J Lead Components, Conduction Method
Procedure covers removal of "J" lead components using direct contact conduction heating.
8.3.2 Component Removal, Surface Mount J Lead Components, Hot Gas/Air Method
8.3.2 Component Removal, Surface Mount J Lead Components, Hot Gas/Air Method
Procedure covers removal of "J" lead components using hot gas.
8.4.1 Component Removal, Surface Mount Gull Wing Components, Conduction Method
8.4.1 Component Removal, Surface Mount Gull Wing Components, Conduction Method
Procedure covers removal of Gull Wing components using direct contact conduction heating.
8.4.2 Component Removal, Surface Mount Gull Wing Components, Hot Gas/Air Method
8.4.2 Component Removal, Surface Mount Gull Wing Components, Hot Gas/Air Method
Procedure covers removal of Gull Wing components using hot gas.

Procedure for reference only.