Circuit Board Rework and Repair Guide
8.0 Rework Procedures
Printed Board Type: N/A
Skill Level: N/A
Conformance Level: N/A
Revision: N/A
Revision Date: N/A
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8.1.1 Removal, Through Hole Vacuum Method
Covers through hole powered vacuum desoldering.
8.1.2 Removal, Through Hole, Solder Fountain
Covers through hole removal using solder fountain. |
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8.2.1 Removal, Chip, Forked Tip Method *
Forked tip method for chip component removal.
8.2.2 Removal, Chip, Hot Tweezer Method *
Hot tweezer method for chip component removal. |
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8.3.1 Removal, J Lead, Conduction Method *
Contact method of J lead component removal.
8.3.2 Removal, J Lead Comp., Hot Gas Method *
Convection method of J lead component removal. |
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8.4.1 Removal, Gull Wing, Conduction Method *
Contact method of gull wing component removal.
8.4.2 Removal, Gull Wing, Hot Gas Method *
Convection method of gull wing component removal. |
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* Procedures include video clips
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