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8.2.2 Component Removal, Surface Mount Chip Components, Hot Tweezer Method

  • This procedure covers one commonly used method for removing surface mount chip components.
  • Place the tweezer tips in position. When the solder melts, lift the component off the circuit board.
Outline
This procedure covers one commonly used method for removing surface mount chip components.

Note
The goal when removing any component is to remove the component as quickly as possible.

Caution - Glued Components
A small dot of epoxy is often used to hold chip components in position during wave soldering processing. Typically these components will be located on the bottom side of a circuit board that has through hole components located on the other side. Whenever you see a board like this, you can generally assume that the chip components will be glued onto the board. You'll need to leave the tip on the component for one or two additional seconds in order to transfer enough heat to over-cure or soften the adhesive. If required take a wooden stick or curved tweezers and push the component sideways until the glue joint finally gives way.

Proprietary Information Proprietary
This guide may contain proprietary or copyright-protected information for access by authorized persons only.

Minimum Skill Level - Intermediate
Recommended for technicians with skills in basic soldering and component rework, but may be inexperienced in general repair/rework procedures.

Conformance Level - High
This procedure most closely duplicates the physical characteristics of the original, and most probably complies with all the functional, environmental and serviceability factors.

Acceptability References
IPC-A-610 12.0 Surface Mount Assemblies  Proprietary
Procedure References
1.0 Foreword
2.1 Handling Electronic Assemblies
2.2 Cleaning
2.5 Baking And Preheating
7.1.1 Soldering Basics
7.1.2 Preparation For Soldering And Component Removal
7.1.3 Solder Joint Acceptability Criteria
IPC7711 3.3.2 Tweezer Method  Proprietary
Tools and Materials
Cleaner
Cleaner
General purpose cleaner for removing contamination.
Microscope
Microscope
Precision microscope with stand and lighting for work and inspection.
Solderinmg Iron
Soldering Iron
Properly maintained soldering iron and properly sized soldering iron tips.
Wipes
Wipes
Nonabrasive, low-linting wipes for cleanup.
Images and Figures
8.2.2 Component Removal, Surface Mount Chip Components, Hot Tweezer Method
Surface Mount Chip Component
8.2.2 Component Removal, Surface Mount Chip Components, Hot Tweezer Method
Figure 1: Place the tweezer tips in position. When the solder melts, lift the component off the circuit board.
8.2.2 Component Removal, Surface Mount Chip Components, Hot Tweezer Method
Chip Capacitors generally have solid color bodies.

8.2.2 Component Removal, Surface Mount Chip Components, Hot Tweezer Method
A - Stripe;B - Beveled Surface;The striped or beveled end is the "positive" (+) or "anode end".
Note
Determine the direction the part is to be swept off the circuit board surface. Densely packed circuit board assemblies often leave only one direction for the rework tool to follow when sweeping the part off the surface

Procedure
  1. Tin the hot tweezer tip.
  2. Apply a small amount of liquid flux to both ends of the component.
  3. Place the tweezer tips in contact with both ends of the component. When the solder melts, lift the component off the circuit board. (See Figure 1)
  4. Clean the area.
Procedure for reference only.
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