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9.0 BGA Component Rework Procedures Print   Next
9.1.1 BGA Component Rework Process Flow
9.1.1 BGA Component Rework Process Flow
Procedure covers general process flow for BGA component rework.
9.1.2 BGA Component Rework Inspection
9.1.2 BGA Component Rework Inspection
Procedure covers general inspection methods for BGA components.
9.2.1 BGA Component Rework Profile Development, Standard Method
9.2.1 BGA Component Rework Profile Development, Standard Method
Procedure covers development of a BGA component rework profile using the standard method.
9.2.2 BGA Component Rework Profile Development, Smart Track Method
9.2.2 BGA Component Rework Profile Development, Smart Track Method
Procedure covers development of a BGA component rework profile using the Smart Track Method.
9.3.1 BGA Component Rework, Eutectic Solder Ball
9.3.1 BGA Component Rework, Eutectic Solder Ball
Procedure covers the hot gas method for eutectic solder ball BGA rework.
9.4.1 BGA Component Reballing, Fixture Method
9.4.1 BGA Component Reballing, Fixture Method
Procedure covers the method for reballing BGA components using replacement balls and a special fixture.

This procedure is for reference only. Refer to the Procedure References listed above, or contact Circuit Technology Center for appropriate industry approved references.
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