The information within these guides should be helpful to anyone who works with bare circuit boards and circuit board assemblies.
These guides are packed with illustrations and videos and follow popular IPC standards.
These guides will help you through the maze of challenges you face when working on modern, high density circuit boards.
If your company complies with ISO-9000 or any demanding quality standard, you can refer to these guides as your on-line reference.
Section 3: Base board repair.
Guides in sections 1 through 6 detail the proper step-by-step techniques, tools and materials, and cautions needed to reliably
repair and modify bare and assembled circuit boards.
Guides in sections 7 through 9 detail the proper step-by-step techniques, tools and materials, and cautions needed to reliably
rework assembled circuit boards covering soldering,
desoldering and BGA rework procedures.
Section 4: Conductor repair.
Each procedure includes a "Conformance Level" indicated as high, medium or low.
This Conformance Level indicates how closely the repaired or reworked product will be to the original specifications.
The Conformance Level listed for each procedure should be used as a guide only.
Each procedure also includes a "Skill Level" providing a gauge for the requisite experience and skill needed by the operator to obtain a reliable outcome.
Section 7, 8 and 9: Soldering, desoldering and BGA rework.
Skill Levels are listed as intermediate, advanced, or expert.
The Skill Level recommended should be used as a guide only.
Hundreds of detailed illustrations, as shown below, are included throughout this guidebook.
Visit the Foreword for more information on this guidebook and how it can be used at your company to reduce waste.