CircuitMedic
45 Research Drive, Haverhill, MA 01832 USA
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Circuit Board Rework and Repair Guide
2.3.1 Coating Removal, Identification of Coating
Printed Board Type: R/F/W/C
Skill Level: Advanced
Conformance Level: High
Revision: D
Revision Date: Jul 7, 2000
OUTLINE
This procedure covers the techniques for identifying various coatings so that the appropriate coating removal method can be selected.
TOOLS & MATERIALS
Brushes
Cleaner
Cutting Disks
Foam Swabs
Knife
Micro-Drill System
Thermal Parting Tool
Wipes
Wood Sticks
PROCEDURE
To determine the appropriate coating removal procedure the coating must first be identified. During original manufacture the specific coating is usually known. Consequently, the coating removal methods can usually be specified and based on the known coatings being used.
When identification of the coating is not available, simple observation and testing will help identify the coating characteristics so that the proper removal procedure can be specified.
NOTE
The generic or commercial identification of the coating material is not necessary to accomplish coating removal.
- Hardness
Penetration test in a non-critical area to determine relative hardness. The harder the coating the more suitable to pure abrasive techniques. The softer and gummier the coatings the more suitable to the brushing removal procedures.
CAUTION
Abrasion operations can generate electrostatic charges.
- Transparency
Obviously transparent coatings are usually more suitable for removal than the opaque type. Removal methods used with opaque coatings must be far more controllable and less sensitive to damaging the covered components and printed board surfaces and are usually slower.
- Solubility
Test the coating for solubility characteristics in a non-critical area with trichloroethane, xylene or other solvents with low toxicity and mild activity
CAUTION
Printed board assemblies should not be immersed in harsh solvents.
- Thermal Removal
Use a thermal parting device with controlled heating and without a cutting edge to determine whether the coating can be thermally removed. Start with a low temperature, approx. 100° C (210° F), and increase the temperature until the coating is removed. If the coating flows or gums up, you are too hot or the coating is not suitable for thermal removal.
CAUTION
Do not exceed the maximum component storage temperature or other limitation.
- Strippability
Carefully slit the coating with a sharp blade in a non-critical area and try to peel back from the surface to determine if this method is feasible. Due to the adhesion required of coating materials, strippable techniques without chemical aids is usually very limited.
- Thickness
Determine if the coating is thick or thin by visual means. Thin coatings show sharp component outlines and no fillets while thick coatings reduce sharp component outlines and show generous fillets at points of component or lead intersection with the printed board. Thick coatings usually require two step removal methods to prevent surface damage to the board. First reduce the thick coating down to a thin one and then use pure abrasion methods to reach the surface of the board.
The specific coating to be removed may have one or more of these characteristics and consequently the removal method selected should consider the composite characteristics.
See Table 1 for Conformal Coating Identification.
See Table 2 for Conformal Coating Removal Methods.
See Table 3 for Conformal Coating Characteristics.
Table 1
Conformal Coating Identification
| Test |
Yes |
No |
| 1. Does the coating feel soft, rubbery or spongy? |
2 |
3 |
| 2. Does the coating have a noticeable reaction to heat? |
Polyurethane |
4 |
| 3. Is there a reaction to alcohol? |
Acrylic |
5 |
| 4. Is the coating thick and does it have a dull surface? |
Silicone Thick |
Silicone Thin |
| 5. Does the coating have a noticeable reaction to heat? |
6 |
Paraxylyene |
| 6. Does the reaction form white powder? |
Epoxy |
Polyurethane |
Table 2 Conformal Coating Removal Methods
Conformal
Coating |
Removal Method |
2.3.2
Solvent
Method |
2.3.3
Peeling
Method |
2.3.4
Thermal
Method |
2.3.5
Grinding
Scraping
Method |
2.3.6
Micro
Blasting
Method |
| Paraxylyene |
|
|
1 |
2 |
3 |
| Epoxy |
|
|
1 |
2 |
3 |
| Acrylic |
1 |
|
2 |
3 |
4 |
| Polyurethane |
3 |
|
1 |
2 |
4 |
| Silicone, Thin |
1 |
|
2 |
3 |
4 |
| Silicone, Thick |
|
1 |
|
2 |
|
NOTE
The preferred order for applying individual removal methods to specific coatings is numerically indicated. These removal methods are listed in ascending order.
Table 3 Conformal Coating Characteristics
| Characteristics |
Conformal Coating Type |
| Epoxy |
Acrylic |
Polyurethane |
Silicone |
Paraxylylene |
| Hard |
X |
|
X |
|
X |
| Meduim Hard |
|
X |
X |
|
|
| Soft |
|
|
X |
X |
|
| Heat Reaction |
X |
X |
X |
|
|
| Surface Bond, Very Strong |
X |
|
|
X |
X |
| Surface Bond, Strong |
|
X |
|
X |
|
| Surface Bond, Meduim |
|
|
X |
X |
|
| Surface Bond, Light |
|
|
|
X |
|
| Solvent Reaction |
|
X |
|
|
|
| Smooth Surface |
X |
X |
X |
X |
X |
| Lumpy Surface |
|
|
|
|
|
| Nonporous Surface |
X |
X |
X |
|
X |
| Glossy Surface |
X |
X |
X |
|
|
| Semiglossy Surface |
X |
|
|
X |
|
| Dull Surface |
|
|
|
|
X |
| Rubbery Surface |
|
|
|
X |
|
| Brittle |
X |
X |
|
|
|
| Chips |
X |
X |
|
|
|
| Peels/Flakes |
|
X |
X |
|
X |
| Stretches |
|
|
X |
X |
|
| Scratch, Dent, Bend, Tear |
|
|
X |
X |
X |
CircuitMedic
45 Research Drive, Haverhill, MA 01832 USA
Phone: 978-374-5000 · Fax: 978-372-5700
Website: www.circuitmedic.com
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