Printed Board Type: R/F/C
Skill Level: Advanced
Conformance Level: High
Revision: Pending
Revision Date: N/A

OUTLINE
This document covers BGA component rework inspection instructions.

REFERENCES
1.0	Foreword
2.1	Handling Electronic Assemblies
2.2	Cleaning
2.5	Baking and Preheating

INTRODUCTION

Ball Grid Array Rework Station

This document has been prepared by Circuit Technology Center, Inc.. The purpose is to ensure repeatable, high quality rework of BGA components, and to assure conformity to the highest industry standards and specifications.

NOTE
This document covers procedure and guidelines specific to BGA component rework conducted by the staff at Circuit Technology Center, Inc. Organizations using this information may need to make modifications, or other changes, to accomodate their own particular needs.

NOTE
This document is under development. Refer to available industry sources including recommendations from IPC while this document is being developed.