First-Aid Kits for Circuit Boards ®
22 Parkridge Road
Haverhill, MA 01835 USA
Copyright © CircuitMedic. All rights reserved.
A Circuit Technology Center Company
Operating Instructions

Instruction No. INS1026

Bonding Tips
Description
Bonding Tips fit into the hand held Bonding Iron or Circuit Bonding System. The bottom machined surface of each Bonding Tip is used to apply heat and pressure to bond adhesive backed Circuit Frames to a circuit board surface. Bonding Tips are machined from high grade aluminum.

Circuit Frames are available in hundreds of shapes including lands, pads and edge contacts. Go to: www.circuitmedic.com/products/circuitframes.html

Pressure
Pressure is the recommended force in pounds to apply to the top surface of the replacement pad, land or conductor based on the Bonding Tip surface area. The recommended Bonding Pressure for Circuit Frames is 200 - 400 psi.

Setting
Setting corresponds to the indication on the scale of the optional 115-4100 Bonding System. Go to: www.circuitmedic.com/products/115-4100.html

Available Tip Sizes
Part No. Description Pressure Setting
115-2104 Bonding Tip, Tapered N/A N/A
115-2204 Bonding Tip, .080" (2.03 mm) Diameter 1.00 lbs 4
115-2206 Bonding Tip, .120" (3.05 mm) Diameter 2.26 lbs 9
115-2306 Bonding Tip, .040" x .060" (1.02 mm x 1.52 mm) 0.48 lbs 2
115-2316 Bonding Tip, .080" x .120" (2.03 mm x 3.05 mm) 1.92 lbs 8

Circuit Frames

Description
Circuit Frames are replacement pads, lands and conductors for circuit board repair. They have a dry-film adhesive backing and are bonded to the circuit board surface using heat and pressure applied by a Bonding Iron or Bonding System. There are hundreds of patterns available.

Go to: www.circuitmedic.com/products/circuitframes.html

Bonding System Operation 115-3104/115-3105
  1. Plug the Bonding System into a proper outlet and allow time for the system to reach the operating temperature, 260 °C (500 °F).
  2. After changing the Bonding Tip, allow one minute for tip temperature to stabilize.
  3. CAUTION: The Bonding System operates at high temperature. Observe necessary precautions to prevent injury.

Bonding Tip Selection
Bonding Tips fit into the hand held Bonding Iron or Circuit Bonding System. The bottom machined surface of each Bonding Tip is used to apply heat and pressure to bond adhesive backed Circuit Frames to a circuit board surface. Bonding Tips are machined from high grade aluminum.

Go to: www.circuitmedic.com/parts/bonding_tips.html

Circuit Frame Repair/Replacement Procedure
  1. Circuit Frame
    Figure 1.
    Remove the defective pad, land or conductor. If there is a connecting circuit on the circuit board surface, apply liquid flux and tin it with solder. See Figure 1.
  2. If the base material is severely damaged, it may need to be repaired. See 115-3302 Circuit Bond instructions. Go to www.http://www.circuitmedic.com/parts/115-3302.html.
  3. Circuit Frame
    Figure 2.
    Select a replacement circuit from a Circuit Frame. Carefully scrape off the adhesive film from the solder joint area. Then trim it out from the Circuit Frame. See Figure 2.
  4. Clean the area, then place the new in position using High Temperature Tape. Check to be sure the new circuit is properly aligned. See Figure 3.
  5. Circuit Frame
    Figure 3.
    Select a Bonding Tip with a surface that closely matches the shape of the new circuit. Insert the Bonding Tip into the Bonding Iron. Plug the Bonding Iron into a proper power source and allow 10 minutes to heat up to the pre-set temperature.
  6. Apply light even perpendicular pressure to the surface of the High Temperature Tape for 5 seconds using the Bonding Iron. The heat transmits through the tape to quickly tack the new circuit in place.
  7. Circuit Frame
    Figure 4.
    Carefully remove the High Temperature Tape leaving the new circuit in place.
  8. Apply heat a second time using the Bonding Iron directly to the top surface of the new circuit. Apply light even perpendicular pressure for 30 seconds to permanently cure the adhesive.
  9. If the new circuit has a connecting circuit, apply liquid flux and the lap solder the connection. See Figure 4.
Reference Procedures
For detailed step by step process instructions for the following procedures.
1.0 Foreword
2.0 Basic Procedures
2.1 Handling Electronic Assemblies
4.2.2 Conductor Repair, Foil Jumper, Film Adhesive Method
4.4.2 Lifted Land Repair, Film Adhesive
4.5.2 Land Repair, Film Adhesive
4.6.2 Edge Contact Repair, Film Adhesive
4.7.2 Surface Mount Pad Repair, Film Adhesive
4.7.3 BGA Pad Repair, Film Adhesive