First-Aid Kits for Circuit Boards ®
22 Parkridge Road
Haverhill, MA 01835 USA
Copyright © CircuitMedic. All rights reserved.
A Circuit Technology Center Company
Operating Instructions

Instruction No. INS257

115-4100 Bonding System
Description
The Bonding System is a precision machine using heated Bonding Tips that deliver a calibtated pressure to bond adhesive-back Circuit Frames to circuit boards. The system has a built-in calibration gauge to maintain a regulated bonding force and a digital temperature controller to maintains a uniform temperature throughout the 30-second replacement circuit bonding cycle.

Initial Setup
  1. Clamp the Bonding System arm to a work bench using the Table Clamp.
  2. Connect the cord from of Bonding System to the Temperature Controller.
  3. The handle on the Bonding System may be repositioned by pulling out and rotating.
  4. The set temperature value can be changed by rotating the temperature dial.

Operation
  1. Circuit Frame
    Figure 1.
    Remove the defective pad, land or conductor. If there is a connecting circuit on the circuit board surface, apply liquid flux and tin it with solder. See Figure 1.
  2. If the base material is severely damaged, it may need to be repaired. See Circuit Bond instructions.
  3. Circuit Frame
    Figure 2.
    Select a replacement circuit from a Circuit Frame. Carefully scrape off the adhesive film from the solder joint area. Trim from the Circuit Frame. See Figure 2.
  4. Place the new circuit in position using High Temperature Tape. See Figure 3.
  5. Select a Bonding Tip that closely matches the shape of the circuit. Insert the Bonding Tip into the Bonding System heater barrel. Turn on the Temperature Controller and set the temperature to 260 °C (500 °F). Allow time for the temperature to stabilize.
  6. Circuit Frame
    Figure 3.
    Place the circuit board in position and align the circuit below the Bonding Tip. Test the alignment by turning the handle to lower the Bonding Tip until it nearly touches the surface. Check to be sure the bottom of the Bonding Tip is parallel to surface of the circuit board.
  7. Turn the handle until the heated Bonding Tip contacts the High Temperature Tape holding the new circuit in position. Continue to turn the handle to apply the proper setting as indicated on the table in instruction INS1026 Bonding Tips. Hold for 5 seconds, then turn the handle in the opposite direction to lift the Bonding Tip from the surface. The heat transmits through the tape to quickly tack the circuit in place.
  8. Circuit Frame
    Figure 4.
    Carefully remove the High Temperature Tape leaving the new circuit in place.
  9. Reposition the circuit board and turn the handle a second time until the heated Bonding Tip directly contacts the new circuit. Continue to turn the handle to apply the proper setting as indicated on the table in instruction INS1026 Bonding Tips. Hold for 30 seconds to permanently cure the adhesive, then turn the handle in the opposite direction to lift the Bonding Tip from the surface.
  10. If the new circuit has a connecting circuit, apply liquid flux and the lap solder the connection. See Figure 4.
Bonding System Includes

CircuitMedic Part
Bonding Tip, .080" (2.03 mm) Diameter
Tip used to bond replacement conductors to circuit boards for repair.
CircuitMedic Part
Bonding Tip, .120" (3.05 mm) Diameter
Tip used to bond replacement conductors to circuit boards for repair.
CircuitMedic Part
Bonding Tip, .040" x .060" (1.02 mm x 1.52 mm)
Tip used to bond replacement conductors to circuit boards for repair.
CircuitMedic Part
Bonding Tip, .080" x .120" (2.03 mm x 3.05 mm)
Tip used to bond replacement conductors to circuit boards for repair.
Circuit Frame
Circuit Frame CBLANKAS
Replacement circuits with a dry-film adhesive backing.
Circuit Frame
Circuit Frame CFV002AS
Replacement circuits with a dry-film adhesive backing.
Circuit Frame
Circuit Frame CFV003AS
Replacement circuits with a dry-film adhesive backing.
Bonding Tips

Description
Bonding Tips fit into the hand held Bonding Iron or Circuit Bonding System. The bottom machined surface of each Bonding Tip is used to apply heat and pressure to bond adhesive backed Circuit Frames to a circuit board surface. Bonding Tips are machined from high grade aluminum.

Circuit Frames are available in hundreds of shapes including lands, pads and edge contacts. Go to: www.circuitmedic.com/products/circuitframes.html

Pressure
Pressure is the recommended force in pounds to apply to the top surface of the replacement pad, land or conductor based on the Bonding Tip surface area. The recommended Bonding Pressure for Circuit Frames is 200 - 400 psi.

Setting
Setting corresponds to the indication on the scale of the optional 115-4100 Bonding System. Go to: www.circuitmedic.com/products/115-4100.html

Available Tip Sizes
Part No. Description Pressure Setting
115-2104 Bonding Tip, Tapered N/A N/A
115-2204 Bonding Tip, .080" (2.03 mm) Diameter 1.00 lbs 4
115-2206 Bonding Tip, .120" (3.05 mm) Diameter 2.26 lbs 9
115-2306 Bonding Tip, .040" x .060" (1.02 mm x 1.52 mm) 0.48 lbs 2
115-2316 Bonding Tip, .080" x .120" (2.03 mm x 3.05 mm) 1.92 lbs 8


Circuit Bond

Description
Circuit Bond is a clear, low viscosity, superior strength epoxy, precisely measured out into two-compartment plastic packages so it's easy to use and there's no measuring.

Specifications
Packaging2 gram pre-measured packages
Mix ratio4 parts resin to 1 part hardener
ColorClear, transparent
Pot life30 minutes
Cure cycle24 hours at room temperature or 4 hours @ 149°F (65°C)
Viscosity (after mixing)2000 cps
Operating temperature range-67°F to 275°F (-55°C to 135°C)
Hardness88 Shore D
Dielectric strength400 volts/mil
Shelf Life6 months minimum


Circuit Bond Application Instructions
  1. Circuit Bond has a working pot life of 30 minutes. It should not be mixed until ready to use.
  2. To use Circuit Bond, remove the plastic clip separating the resin and hardener. Squeeze back and forth from one half of the package to the other to mix the contents.
  3. Cut a corner off the package and squeeze all the contents into a Plastic Cup. Stir the contents to ensure it is thoroughly mixed.
  4. NOTE: Circuit Bond may contain bubbles from the mixing process. If needed use a vacuum system to remove bubbles.
  5. If desired Color Agent can be mixed in with Circuit Bond to match surface colors.
  6. Apply using a Foam Swab, Micro Probe or Mixing Stick as required.
  7. Cure Circuit Bond for 24 hours at room temperature or 4 hours at 65°C (150°F).

Circuit Frames

Description
Circuit Frames are replacement pads, lands and conductors for circuit board repair. They have a dry-film adhesive backing and are bonded to the circuit board surface using heat and pressure applied by a Bonding Iron or Bonding System. There are hundreds of patterns available.

Go to: www.circuitmedic.com/products/circuitframes.html

Bonding System Operation 115-3104/115-3105
  1. Plug the Bonding System into a proper outlet and allow time for the system to reach the operating temperature, 260 °C (500 °F).
  2. After changing the Bonding Tip, allow one minute for tip temperature to stabilize.
  3. CAUTION: The Bonding System operates at high temperature. Observe necessary precautions to prevent injury.

Bonding Tip Selection
Bonding Tips fit into the hand held Bonding Iron or Circuit Bonding System. The bottom machined surface of each Bonding Tip is used to apply heat and pressure to bond adhesive backed Circuit Frames to a circuit board surface. Bonding Tips are machined from high grade aluminum.

Go to: www.circuitmedic.com/parts/bonding_tips.html

Circuit Frame Repair/Replacement Procedure
  1. Circuit Frame
    Figure 1.
    Remove the defective pad, land or conductor. If there is a connecting circuit on the circuit board surface, apply liquid flux and tin it with solder. See Figure 1.
  2. If the base material is severely damaged, it may need to be repaired. See 115-3302 Circuit Bond instructions. Go to www.http://www.circuitmedic.com/parts/115-3302.html.
  3. Circuit Frame
    Figure 2.
    Select a replacement circuit from a Circuit Frame. Carefully scrape off the adhesive film from the solder joint area. Then trim it out from the Circuit Frame. See Figure 2.
  4. Clean the area, then place the new in position using High Temperature Tape. Check to be sure the new circuit is properly aligned. See Figure 3.
  5. Circuit Frame
    Figure 3.
    Select a Bonding Tip with a surface that closely matches the shape of the new circuit. Insert the Bonding Tip into the Bonding Iron. Plug the Bonding Iron into a proper power source and allow 10 minutes to heat up to the pre-set temperature.
  6. Apply light even perpendicular pressure to the surface of the High Temperature Tape for 5 seconds using the Bonding Iron. The heat transmits through the tape to quickly tack the new circuit in place.
  7. Circuit Frame
    Figure 4.
    Carefully remove the High Temperature Tape leaving the new circuit in place.
  8. Apply heat a second time using the Bonding Iron directly to the top surface of the new circuit. Apply light even perpendicular pressure for 30 seconds to permanently cure the adhesive.
  9. If the new circuit has a connecting circuit, apply liquid flux and the lap solder the connection. See Figure 4.
Reference Procedures
For detailed step by step process instructions for the following procedures.
1.0 Foreword
2.0 Basic Procedures
2.2 Cleaning
2.7 Epoxy Mixing and Handling
3.0 Base Board Procedures
4.1.2 Lifted Conductor Repair, Film Adhesive
4.2.2 Conductor Repair, Foil Jumper, Film Adhesive Method
4.5.2 Land Repair, Film Adhesive
4.6.2 Edge Contact Repair, Film Adhesive
4.7.2 Surface Mount Pad Repair, Film Adhesive
4.7.3 BGA Pad Repair, Film Adhesive