First-Aid Kits for Circuit Boards ®
22 Parkridge Road
Haverhill, MA 01835 USA
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A Circuit Technology Center Company
Operating Instructions

Instruction No. INS82

115-1322 Circuit Bond Kit
Description
This kit containing 10 packages of clear, low viscosity, superior strength epoxy. Circuit Bond can be used to bond replacement conductors, repair burns, repair solder mask, and many other high strength, high temperature applications.
Circuit Bond Kit Includes

CircuitMedic Part
Circuit Bond Packs
Clear, superior strength epoxy in two-compartment plastic packages
CircuitMedic Part
Foam Swab
Ideal for absorbing cleaning solvents, and applying color agents and epoxies.
CircuitMedic Part
Micro Probes
Use to dispense a minute amount of adhesive and for micro-positioning of small objects.
CircuitMedic Part
Mixing Picks
Unique mixing sticks have a paddle shape on one and sharp pick on the opposite end.
CircuitMedic Part
Plastic Cup
Small disposable cup for mixing epoxies and holding small items.
CircuitMedic Part
Alcohol Swab
Self-saturating Isopropyl alcohol swab. Squeeze handle to release alcohol.
Circuit Bond

Description
Circuit Bond is a clear, low viscosity, superior strength epoxy, precisely measured out into two-compartment plastic packages so it's easy to use and there's no measuring.

Specifications
Packaging2 gram pre-measured packages
Mix ratio4 parts resin to 1 part hardener
ColorClear, transparent
Pot life30 minutes
Cure cycle24 hours at room temperature or 4 hours @ 149°F (65°C)
Viscosity (after mixing)2000 cps
Operating temperature range-67°F to 275°F (-55°C to 135°C)
Hardness88 Shore D
Dielectric strength400 volts/mil
Shelf Life6 months minimum


Circuit Bond Application Instructions
  1. Circuit Bond has a working pot life of 30 minutes. It should not be mixed until ready to use.
  2. To use Circuit Bond, remove the plastic clip separating the resin and hardener. Squeeze back and forth from one half of the package to the other to mix the contents.
  3. Cut a corner off the package and squeeze all the contents into a Plastic Cup. Stir the contents to ensure it is thoroughly mixed.
  4. NOTE: Circuit Bond may contain bubbles from the mixing process. If needed use a vacuum system to remove bubbles.
  5. If desired Color Agent can be mixed in with Circuit Bond to match surface colors.
  6. Apply using a Foam Swab, Micro Probe or Mixing Stick as required.
  7. Cure Circuit Bond for 24 hours at room temperature or 4 hours at 65°C (150°F).

Reference Procedures
For detailed step by step process instructions for the following procedures.
1.0 Foreword
2.0 Basic Procedures
2.2 Cleaning
2.4.1 Coating Replacement, Solder Mask
2.5 Baking and Preheating
2.7 Epoxy Mixing and Handling
3.0 Base Board Procedures
3.5.1 Base Material Repair, Epoxy Method
3.5.2 Base Material Repair, Area Transplant
3.5.3 Base Material Repair, Edge Transplant Method