First-Aid Kits for Circuit Boards ®
22 Parkridge Road
Haverhill, MA 01835 USA
Copyright © CircuitMedic. All rights reserved.
A Circuit Technology Center Company
Operating Instructions

Instruction No. INS845

201-1400 Land/Pad Repair Kit
Description
This kit includes the tools and materials needed to reliably repair or replace damaged lands, surface mount pads and BGA pads.
Land/Pad Repair Kit Includes

CircuitMedic Part
Abrader
Mild abrasive for removing oxides and contaminates from conductive surfaces.
CircuitMedic Part
Alcohol Swab
Self-saturating Isopropyl alcohol swab. Squeeze handle to release alcohol.
CircuitMedic Part
Bonding Station, 120 VAC
Delivers the optimal heat for curing adhesive bonding film.
CircuitMedic Part
Bonding Tip, Tapered
Tip used to bond replacement conductors to circuit boards for repair.
CircuitMedic Part
Bonding Tip, .080" (2.03 mm) Diameter
Tip used to bond replacement conductors to circuit boards for repair.
CircuitMedic Part
Bonding Tip, .120" (3.05 mm) Diameter
Tip used to bond replacement conductors to circuit boards for repair.
CircuitMedic Part
Bonding Tip, .080" x .120" (2.03 mm x 3.05 mm)
Tip used to bond replacement conductors to circuit boards for repair.
CircuitMedic Part
Circuit Bond Packs
Clear, superior strength epoxy in two-compartment plastic packages
Circuit Frame
Circuit Frame CFV002AS
Replacement circuits with a dry-film adhesive backing.
Circuit Frame
Circuit Frame CFV003AS
Replacement circuits with a dry-film adhesive backing.
CircuitMedic Part
Cleaning Brushes
Disposable brushes for use with solvents for cleaning and application of coatings.
CircuitMedic Part
Foam Swab
Ideal for absorbing cleaning solvents, and applying color agents and epoxies.
CircuitMedic Part
High Temp Tape Discs
High temperature polyimide tape discs, .25" diameter.
CircuitMedic Part
High Temp Tape Discs
High temperature polyimide tape discs, .50" diameter.
CircuitMedic Part
Knife with #16 Blades
A must-have tool for precise cutting, scraping and trimming.
CircuitMedic Part
Measuring Microscope Pen, 25X
Pocket pen microscope with measuring reticle.
CircuitMedic Part
Micro Probes
Use to dispense a minute amount of adhesive and for micro-positioning of small objects.
CircuitMedic Part
Mixing Picks
Unique mixing sticks have a paddle shape on one and sharp pick on the opposite end.
CircuitMedic Part
Plastic Cup
Small disposable cup for mixing epoxies and holding small items.
CircuitMedic Part
Probe
Sharp dental style probe for manipulating small objects and removal of small debris.
CircuitMedic Part
Tweezer, Crossover
Self locking stainless steel tweezers provide hands-free clamping force.
CircuitMedic Part
Tweezer, Point Tip
Fine point tweezers for precision work.
Bonding Tips

Description
Bonding Tips fit into the hand held Bonding Iron or Circuit Bonding System. The bottom machined surface of each Bonding Tip is used to apply heat and pressure to bond adhesive backed Circuit Frames to a circuit board surface. Bonding Tips are machined from high grade aluminum.

Circuit Frames are available in hundreds of shapes including lands, pads and edge contacts. Go to: www.circuitmedic.com/products/circuitframes.html

Pressure
Pressure is the recommended force in pounds to apply to the top surface of the replacement pad, land or conductor based on the Bonding Tip surface area. The recommended Bonding Pressure for Circuit Frames is 200 - 400 psi.

Setting
Setting corresponds to the indication on the scale of the optional 115-4100 Bonding System. Go to: www.circuitmedic.com/products/115-4100.html

Available Tip Sizes
Part No. Description Pressure Setting
115-2104 Bonding Tip, Tapered N/A N/A
115-2204 Bonding Tip, .080" (2.03 mm) Diameter 1.00 lbs 4
115-2206 Bonding Tip, .120" (3.05 mm) Diameter 2.26 lbs 9
115-2306 Bonding Tip, .040" x .060" (1.02 mm x 1.52 mm) 0.48 lbs 2
115-2316 Bonding Tip, .080" x .120" (2.03 mm x 3.05 mm) 1.92 lbs 8


Circuit Bond

Description
Circuit Bond is a clear, low viscosity, superior strength epoxy, precisely measured out into two-compartment plastic packages so it's easy to use and there's no measuring.

Specifications
Packaging2 gram pre-measured packages
Mix ratio4 parts resin to 1 part hardener
ColorClear, transparent
Pot life30 minutes
Cure cycle24 hours at room temperature or 4 hours @ 149°F (65°C)
Viscosity (after mixing)2000 cps
Operating temperature range-67°F to 275°F (-55°C to 135°C)
Hardness88 Shore D
Dielectric strength400 volts/mil
Shelf Life6 months minimum


Circuit Bond Application Instructions
  1. Circuit Bond has a working pot life of 30 minutes. It should not be mixed until ready to use.
  2. To use Circuit Bond, remove the plastic clip separating the resin and hardener. Squeeze back and forth from one half of the package to the other to mix the contents.
  3. Cut a corner off the package and squeeze all the contents into a Plastic Cup. Stir the contents to ensure it is thoroughly mixed.
  4. NOTE: Circuit Bond may contain bubbles from the mixing process. If needed use a vacuum system to remove bubbles.
  5. If desired Color Agent can be mixed in with Circuit Bond to match surface colors.
  6. Apply using a Foam Swab, Micro Probe or Mixing Stick as required.
  7. Cure Circuit Bond for 24 hours at room temperature or 4 hours at 65°C (150°F).

Circuit Frames

Description
Circuit Frames are replacement pads, lands and conductors for circuit board repair. They have a dry-film adhesive backing and are bonded to the circuit board surface using heat and pressure applied by a Bonding Iron or Bonding System. There are hundreds of patterns available.

Go to: www.circuitmedic.com/products/circuitframes.html

Bonding System Operation 115-3104/115-3105
  1. Plug the Bonding System into a proper outlet and allow time for the system to reach the operating temperature, 260 °C (500 °F).
  2. After changing the Bonding Tip, allow one minute for tip temperature to stabilize.
  3. CAUTION: The Bonding System operates at high temperature. Observe necessary precautions to prevent injury.

Bonding Tip Selection
Bonding Tips fit into the hand held Bonding Iron or Circuit Bonding System. The bottom machined surface of each Bonding Tip is used to apply heat and pressure to bond adhesive backed Circuit Frames to a circuit board surface. Bonding Tips are machined from high grade aluminum.

Go to: www.circuitmedic.com/parts/bonding_tips.html

Circuit Frame Repair/Replacement Procedure
  1. Circuit Frame
    Figure 1.
    Remove the defective pad, land or conductor. If there is a connecting circuit on the circuit board surface, apply liquid flux and tin it with solder. See Figure 1.
  2. If the base material is severely damaged, it may need to be repaired. See 115-3302 Circuit Bond instructions. Go to www.http://www.circuitmedic.com/parts/115-3302.html.
  3. Circuit Frame
    Figure 2.
    Select a replacement circuit from a Circuit Frame. Carefully scrape off the adhesive film from the solder joint area. Then trim it out from the Circuit Frame. See Figure 2.
  4. Clean the area, then place the new in position using High Temperature Tape. Check to be sure the new circuit is properly aligned. See Figure 3.
  5. Circuit Frame
    Figure 3.
    Select a Bonding Tip with a surface that closely matches the shape of the new circuit. Insert the Bonding Tip into the Bonding Iron. Plug the Bonding Iron into a proper power source and allow 10 minutes to heat up to the pre-set temperature.
  6. Apply light even perpendicular pressure to the surface of the High Temperature Tape for 5 seconds using the Bonding Iron. The heat transmits through the tape to quickly tack the new circuit in place.
  7. Circuit Frame
    Figure 4.
    Carefully remove the High Temperature Tape leaving the new circuit in place.
  8. Apply heat a second time using the Bonding Iron directly to the top surface of the new circuit. Apply light even perpendicular pressure for 30 seconds to permanently cure the adhesive.
  9. If the new circuit has a connecting circuit, apply liquid flux and the lap solder the connection. See Figure 4.
Reference Procedures
For detailed step by step process instructions for the following procedures.
1.0 Foreword
2.0 Basic Procedures
2.2 Cleaning
2.4.1 Coating Replacement, Solder Mask
2.7 Epoxy Mixing and Handling
3.0 Base Board Procedures
4.1.1 Lifted Conductor Repair, Epoxy Seal Method
4.1.2 Lifted Conductor Repair, Film Adhesive
4.4.1 Lifted Land Repair, Epoxy Seal
4.4.2 Lifted Land Repair, Film Adhesive
4.5.1 Land Repair, Epoxy Method
4.5.2 Land Repair, Film Adhesive
4.7.1 Surface Mount Pad Repair, Adhesive Method
4.7.2 Surface Mount Pad Repair, Film Adhesive
4.7.3 BGA Pad Repair, Film Adhesive