First-Aid Kits for Circuit Boards ®
22 Parkridge Road
Haverhill, MA 01835 USA
Copyright © CircuitMedic. All rights reserved.
A Circuit Technology Center Company
Operating Instructions

Instruction No. INS846

201-2400 Master Repair Kit
Description
The Master Repair Kit includes tools and materials to repair circuit board damage including pads, lands, conductors and base material.
Master Repair Kit Includes

CircuitMedic Part
Abrader
Mild abrasive for removing oxides and contaminates from conductive surfaces.
CircuitMedic Part
Alcohol Swab
Self-saturating Isopropyl alcohol swab. Squeeze handle to release alcohol.
CircuitMedic Part
Bonding Film
Dry film adhesive used to bond lifted lands, pads and conductors.
CircuitMedic Part
Bonding Station, 120 VAC
Delivers the optimal heat for curing adhesive bonding film.
CircuitMedic Part
Bonding Tip, Tapered
Tip used to bond replacement conductors to circuit boards for repair.
CircuitMedic Part
Bonding Tip, .080" (2.03 mm) Diameter
Tip used to bond replacement conductors to circuit boards for repair.
CircuitMedic Part
Bonding Tip, .120" (3.05 mm) Diameter
Tip used to bond replacement conductors to circuit boards for repair.
CircuitMedic Part
Circuit Board
Circuit board perfect for practice work.
CircuitMedic Part
Circuit Bond Packs
Clear, superior strength epoxy in two-compartment plastic packages
Circuit Frame
Circuit Frame CBLANKAS
Replacement circuits with a dry-film adhesive backing.
Circuit Frame
Circuit Frame CFV002AS
Replacement circuits with a dry-film adhesive backing.
Circuit Frame
Circuit Frame CFV003AS
Replacement circuits with a dry-film adhesive backing.
CircuitMedic Part
Circuit Track, .002" x .006"
Rectangular shaped pure copper wire used to repair damaged conductors.
CircuitMedic Part
Circuit Track, .002" x .010"
Rectangular shaped pure copper wire used to repair damaged conductors.
CircuitMedic Part
Circuit Track, .003" x .015"
Rectangular shaped pure copper wire used to repair damaged conductors.
CircuitMedic Part
Circuit Track, .005" x .030"
Rectangular shaped pure copper wire used to repair damaged conductors.
CircuitMedic Part
Cleaning Brushes
Disposable brushes for use with solvents for cleaning and application of coatings.
CircuitMedic Part
Color Agent, Green
Use to tint epoxy for solder mask and base board repair.
CircuitMedic Part
Color Agent, Light Green
Use to tint epoxy for solder mask and base board repair.
CircuitMedic Part
Foam Swab
Ideal for absorbing cleaning solvents, and applying color agents and epoxies.
CircuitMedic Part
High Temp Tape Discs
High temperature polyimide tape discs, .25" diameter.
CircuitMedic Part
High Temp Tape Discs
High temperature polyimide tape discs, .50" diameter.
CircuitMedic Part
Knife with #16 Blades
A must-have tool for precise cutting, scraping and trimming.
CircuitMedic Part
Measuring Microscope Pen, 25X
Pocket pen microscope with measuring reticle.
CircuitMedic Part
Micro Probes
Use to dispense a minute amount of adhesive and for micro-positioning of small objects.
CircuitMedic Part
Mixing Picks
Unique mixing sticks have a paddle shape on one and sharp pick on the opposite end.
CircuitMedic Part
Plastic Cup
Small disposable cup for mixing epoxies and holding small items.
CircuitMedic Part
Probe
Sharp dental style probe for manipulating small objects and removal of small debris.
CircuitMedic Part
Scraper
Hardened stainless steel tip for scraping solder mask and removing defects.
CircuitMedic Part
Syringes
Polypropylene syringe barrels with stainless steel dispensing tips.
CircuitMedic Part
Tweezer, Crossover
Self locking stainless steel tweezers provide hands-free clamping force.
CircuitMedic Part
Tweezer, Point Tip
Fine point tweezers for precision work.
CircuitMedic Part
Wire Guide
Use to form bends in wires and hold wires during soldering and bonding.
Bonding Tips

Description
Bonding Tips fit into the hand held Bonding Iron or Circuit Bonding System. The bottom machined surface of each Bonding Tip is used to apply heat and pressure to bond adhesive backed Circuit Frames to a circuit board surface. Bonding Tips are machined from high grade aluminum.

Circuit Frames are available in hundreds of shapes including lands, pads and edge contacts. Go to: www.circuitmedic.com/products/circuitframes.html

Pressure
Pressure is the recommended force in pounds to apply to the top surface of the replacement pad, land or conductor based on the Bonding Tip surface area. The recommended Bonding Pressure for Circuit Frames is 200 - 400 psi.

Setting
Setting corresponds to the indication on the scale of the optional 115-4100 Bonding System. Go to: www.circuitmedic.com/products/115-4100.html

Available Tip Sizes
Part No. Description Pressure Setting
115-2104 Bonding Tip, Tapered N/A N/A
115-2204 Bonding Tip, .080" (2.03 mm) Diameter 1.00 lbs 4
115-2206 Bonding Tip, .120" (3.05 mm) Diameter 2.26 lbs 9
115-2306 Bonding Tip, .040" x .060" (1.02 mm x 1.52 mm) 0.48 lbs 2
115-2316 Bonding Tip, .080" x .120" (2.03 mm x 3.05 mm) 1.92 lbs 8


Circuit Bond

Description
Circuit Bond is a clear, low viscosity, superior strength epoxy, precisely measured out into two-compartment plastic packages so it's easy to use and there's no measuring.

Specifications
Packaging2 gram pre-measured packages
Mix ratio4 parts resin to 1 part hardener
ColorClear, transparent
Pot life30 minutes
Cure cycle24 hours at room temperature or 4 hours @ 149°F (65°C)
Viscosity (after mixing)2000 cps
Operating temperature range-67°F to 275°F (-55°C to 135°C)
Hardness88 Shore D
Dielectric strength400 volts/mil
Shelf Life6 months minimum


Circuit Bond Application Instructions
  1. Circuit Bond has a working pot life of 30 minutes. It should not be mixed until ready to use.
  2. To use Circuit Bond, remove the plastic clip separating the resin and hardener. Squeeze back and forth from one half of the package to the other to mix the contents.
  3. Cut a corner off the package and squeeze all the contents into a Plastic Cup. Stir the contents to ensure it is thoroughly mixed.
  4. NOTE: Circuit Bond may contain bubbles from the mixing process. If needed use a vacuum system to remove bubbles.
  5. If desired Color Agent can be mixed in with Circuit Bond to match surface colors.
  6. Apply using a Foam Swab, Micro Probe or Mixing Stick as required.
  7. Cure Circuit Bond for 24 hours at room temperature or 4 hours at 65°C (150°F).

Circuit Frames

Description
Circuit Frames are replacement pads, lands and conductors for circuit board repair. They have a dry-film adhesive backing and are bonded to the circuit board surface using heat and pressure applied by a Bonding Iron or Bonding System. There are hundreds of patterns available.

Go to: www.circuitmedic.com/products/circuitframes.html

Bonding System Operation 115-3104/115-3105
  1. Plug the Bonding System into a proper outlet and allow time for the system to reach the operating temperature, 260 °C (500 °F).
  2. After changing the Bonding Tip, allow one minute for tip temperature to stabilize.
  3. CAUTION: The Bonding System operates at high temperature. Observe necessary precautions to prevent injury.

Bonding Tip Selection
Bonding Tips fit into the hand held Bonding Iron or Circuit Bonding System. The bottom machined surface of each Bonding Tip is used to apply heat and pressure to bond adhesive backed Circuit Frames to a circuit board surface. Bonding Tips are machined from high grade aluminum.

Go to: www.circuitmedic.com/parts/bonding_tips.html

Circuit Frame Repair/Replacement Procedure
  1. Circuit Frame
    Figure 1.
    Remove the defective pad, land or conductor. If there is a connecting circuit on the circuit board surface, apply liquid flux and tin it with solder. See Figure 1.
  2. If the base material is severely damaged, it may need to be repaired. See 115-3302 Circuit Bond instructions. Go to www.http://www.circuitmedic.com/parts/115-3302.html.
  3. Circuit Frame
    Figure 2.
    Select a replacement circuit from a Circuit Frame. Carefully scrape off the adhesive film from the solder joint area. Then trim it out from the Circuit Frame. See Figure 2.
  4. Clean the area, then place the new in position using High Temperature Tape. Check to be sure the new circuit is properly aligned. See Figure 3.
  5. Circuit Frame
    Figure 3.
    Select a Bonding Tip with a surface that closely matches the shape of the new circuit. Insert the Bonding Tip into the Bonding Iron. Plug the Bonding Iron into a proper power source and allow 10 minutes to heat up to the pre-set temperature.
  6. Apply light even perpendicular pressure to the surface of the High Temperature Tape for 5 seconds using the Bonding Iron. The heat transmits through the tape to quickly tack the new circuit in place.
  7. Circuit Frame
    Figure 4.
    Carefully remove the High Temperature Tape leaving the new circuit in place.
  8. Apply heat a second time using the Bonding Iron directly to the top surface of the new circuit. Apply light even perpendicular pressure for 30 seconds to permanently cure the adhesive.
  9. If the new circuit has a connecting circuit, apply liquid flux and the lap solder the connection. See Figure 4.
Circuit Tracks

Description
Circuit Tracks are rectangular shaped conductors made of pure copper. These rectangular ribbons closely conform to the original conductor dimensions. The replacement Circuit Track is bonded in place using epoxy.

Circuit Track Repair
  1. Circuit Track
    Figure 1.
    Remove the damaged section of circuit using a knife. Scrape off any solder mask or coating from the ends of the remaining circuits. (See Figure 1.)
  2. Clean the area, then apply a small amount of flux to the ends of the circuits on the circuit board. Tin both ends using solder and a soldering iron.
  3. Circuit Track
    Figure 2.
    Select a Circuit Track to match the width and thickness of the circuit to be replaced and cut a length as needed.
  4. Remove the invisible protective coating from both ends on the Circuit Track by gently abrading the top and bottom surfaces using an Abrader. Removal of the coating is required to ensure a good solder connection to the circuit board.
  5. Circuit Track
    Figure 3.
    Place one end of the Circuit Track in position and hold in place with High Temperature Tape. (See Figure 2.)
  6. Lap solder the taped end of the Circuit Track to the existing circuit using solder, flux and a soldering iron.
  7. Bend the Circuit Track as needed to match the shape of the missing circuit. (See Figure 3)
  8. Circuit Track
    Figure 4.
    Lap solder the remaining end of Circuit Track to the remaining circuit using solder, flux and a soldering iron.
  9. Clean the area, then coat the top and sides of the Circuit Track with epoxy as required.


Available Sizes
Part No. Description
115-5204 Circuit Track, .002" x .004"
115-5205 Circuit Track, .002" x .005"
115-5206 Circuit Track, .002" x .006"
115-5208 Circuit Track, .002" x .008"
115-5210 Circuit Track, .002" x .010"
115-5312 Circuit Track, .003" x .012"
115-5315 Circuit Track, .003" x .015"
115-5520 Circuit Track, .005" x .020"
115-5530 Circuit Track, .005" x .030"


Color Agents

Description
Color Agent is a one part, air-drying, semi-paste ink commonly used for printing on hard surfaces, including circuit board base materials. Color Agent can be applied directly to circuit board surfaces prior to overcoating. When applied directly to a circuit board surface apply a thin coating and cure for 24 hours at room temperature or 4 hours @ 65°C (150°F).

Color Agent can be used to tint the color of 115-3302 Circuit Bond epoxy used for solder mask repair or circuit base board repair. For information on 115-3302 Circuit Bond go to: www.circuitmedic.com/parts/115-3302.

Color Agent is supplied in 1 oz. (29 ml) collapsible metal tubes.

Available Colors

Part No. Description Color
115-9102 115-9102 Color Agent, Yellow  
115-9185 115-9185 Color Agent, Red  
115-9293 115-9293 Color Agent, Blue  
115-9348 115-9348 Color Agent, Green  
115-9358 115-9358 Color Agent, Light Green  
115-9376 115-9376 Color Agent, Medium Green  
115-9424 115-9424 Color Agent, Dark Gray  
115-9457 115-9457 Color Agent, Light Brown  
115-9560 115-9560 Color Agent, Dark Green  
115-9561 115-9561 Color Agent, Green  
115-9995 115-9995 Color Agent, Black  
115-9996 115-9996 Color Agent - White  




Wire Dots

Description
Wire Dots are pre-cut shapes of a thin, flexible polymer film membrane coated on one side with a high performance, electronics grade permanent pressure sensitive adhesive. Wire Dots are specifically designed to secure jumper wires to circuit boards.

Specifications
Cover FilmClear Polyester Film 1.0 mil (.025 mm) Thick
AdhesiveHigh performance Acrylic Adhesive 5.2 mils (0.13 mm) Thick (3M #3468MP)
Relative High Temperature Operating RangesShort term (minutes/hours) 400°F (204°C)
Long term (days/weeks) 300°F (149°C)
ApplicationSpecifically designed for long term bonding to printed circuit boards and high surface energy plastics for the aerospace, medical and industrial equipment, automotive, appliance and electronic markets.
Shelf LifeMinimum 12 months.


Physical and Thermal Properties
PropertyTypical ValueUnitTest Method
Peel Strength 72 hrs @ 22 C840z./in.ASTM D3330 Modified
Static Shear Strength 72 F (22 C) / 1000g>10,000minASTM D3654
Tensile Strength (Yield) 72 F (22 C)>2600psiASTM D2370
Elongation100%ASTM D2370
Thermal Conductivity0.17w/m-kASTM C518
Coefficient of Thermal Expansion5.5 x 10 -4m/m/CASTM D696 25-175C


Shown approx actual size
Wire Dots
310-0651
.256" (6.5 mm) Round
Wire Dots
310-0652
.256" (6.5 mm) Square
Wire Dots
310-1001
.394" (10.0 mm) Round
Wire Dots
310-1002
.394" (10.0 mm) Square

Wire Dots Application Instructions
  1. Wire Dots
    Figure 1.
    In order to achieve maximum bond strength and reliability, the application surface must be clean, dry and free of flux, skin oils and other contaminants. Clean with isopropyl alcohol or equivalent if necessary.
  2. Firm application pressure develops better adhesive contact and thus improves bond strength. Avoid placing Wire Dots over exposed copper or plated surfaces.
  3. Wire Dots
    Figure 2.
    To use, simply peel a Wire Dot off the backer sheet and place over the wire as show in Figure 1.
  4. The larger size Wire Dots can be used to bond up to 3 jumper wires as show in Figure 2.

Reference Procedures
For detailed step by step process instructions for the following procedures.
1.0 Foreword
2.0 Basic Procedures
2.2 Cleaning
2.4.1 Coating Replacement, Solder Mask
2.7 Epoxy Mixing and Handling
3.0 Base Board Procedures
4.1.1 Lifted Conductor Repair, Epoxy Seal Method
4.1.2 Lifted Conductor Repair, Film Adhesive
4.2.1 Conductor Repair, Foil Jumper, Epoxy Method
4.2.2 Conductor Repair, Foil Jumper, Film Adhesive Method
4.4.1 Lifted Land Repair, Epoxy Seal
4.4.2 Lifted Land Repair, Film Adhesive
4.5.1 Land Repair, Epoxy Method
4.5.2 Land Repair, Film Adhesive
4.6.1 Edge Contact Repair, Adhesive Method
4.6.2 Edge Contact Repair, Film Adhesive
4.7.1 Surface Mount Pad Repair, Adhesive Method
4.7.2 Surface Mount Pad Repair, Film Adhesive
4.7.3 BGA Pad Repair, Film Adhesive