115-2310 Bonding Tip, .050" x .050" (1.27 mm x 1.27 mm)
Bonding Tips fit into the hand held Bonding Iron or Circuit Bonding System. The bottom machined surface of each Bonding Tip is used to apply heat and pressure to bond adhesive backed replacement lands, pads and edge contacts to a circuit board surface. All Bonding Tips are machined from high grade aluminum.
Harmonize Code: 8207.19.5030
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