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115-2706 Bonding Film
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This sheet of Bonding Film is 1.50" x 2.25" (3.8 x 5.7 cm) in size. It is the same dry adhesive film we apply to circuit frames. Works great when you need to repair lifted pads and conductors without the need to use messy liquid adhesives.
Specifications
| Overall Size |
2.25" x 1.50" (57 x 38 mm) |
| Adhesive |
Phenolic film adhesive .002" (.051 mm) thick. |
| Bonding Temperature |
475°F +/- 25°F (246°C +/- 14°C) |
| Bonding Time |
30 seconds |
| Peel Strength |
Minimum 8 lbs/inch (1.43 kg/cm) after cure to FR-4 material. |
| Shelf Life |
1 year minimum. |
| REACH |
CircuitMedic Bonding Film contain less than 0.1% by weight any substance listed as a very high concern in Article 59 of REACH. |
| Outgassing |
CircuitMedic Bonding Film consistently meets the criteria for NASA applications. Maximum 1.0% TML and a Maximum 0.10% CVCM. Samples have been submitted for testing to Goddard Space Flight Center and other facilities, and the results are; Data Reference: GSC 17366; %TML: 0.94%; %CVCM: 0.06% |
More Information
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| Part No. |
Price |
Order |
| 115-2706 |
$16.50 Each |
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Harmonize Code: 3909.40.0000
To order click the "Order" button and follow the instructions.
You may also order from distributors around the world.
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Related Items/Included With
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Circuit Technology Center has been an IPC member since 1986
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Surgeon grade rework and repair,
by the book and guaranteed. ® |
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