115-2706 Bonding Film
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This sheet of Bonding Film is 1.50" x 2.25" (3.8 x 5.7 cm) in size. It is the same dry adhesive film we apply to circuit frames. Works great when you need to repair lifted pads and conductors without the need to use messy liquid adhesives.
Specifications
Overall Size |
2.25" x 1.50" (57 x 38 mm) |
Adhesive |
Phenolic film adhesive .002" (.051 mm) thick. |
Bonding Temperature |
475°F +/- 25°F (246°C +/- 14°C) |
Bonding Time |
30 seconds |
Peel Strength |
Minimum 8 lbs/inch (1.43 kg/cm) after cure to FR-4 material. |
Shelf Life |
1 year minimum. |
REACH |
CircuitMedic Bonding Film contain less than 0.1% by weight any substance listed as a very high concern in Article 59 of REACH. |
Outgassing |
CircuitMedic Bonding Film consistently meets the criteria for NASA applications. Maximum 1.0% TML and a Maximum 0.10% CVCM. Samples have been submitted for testing to Goddard Space Flight Center and other facilities, and the results are; Data Reference: GSC 17366; %TML: 0.94%; %CVCM: 0.06% |
More Information
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Part No. |
Price |
Order |
115-2706 |
$16.50 Each |
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Harmonize Code: 3909.40.0000
To order click the "Order" button and follow the instructions.
You may also order from distributors around the world.
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Related Items/Included With
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Circuit Technology Center has been an IPC member since 1986
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Surgeon grade rework and repair, by the book and guaranteed. ® |
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