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115-2706 Bonding Film
115-2706 Bonding Film
This sheet of Bonding Film is 1.50" x 2.25" (3.8 x 5.7 cm) in size. It is the same dry adhesive film we apply to circuit frames. Works great when you need to repair lifted pads and conductors without the need to use messy liquid adhesives.

Overall Size 2.25" x 1.50" (57 x 38 mm)
Adhesive Phenolic film adhesive .002" (.051 mm) thick.
Bonding Temperature 475°F +/- 25°F (246°C +/- 14°C)
Bonding Time 30 seconds
Peel Strength Minimum 8 lbs/inch (1.43 kg/cm) after cure to FR-4 material.
Shelf Life 1 year minimum.
REACH CircuitMedic Bonding Film contain less than 0.1% by weight any substance listed as a very high concern in Article 59 of REACH.
Outgassing CircuitMedic Bonding Film consistently meets the criteria for NASA applications. Maximum 1.0% TML and a Maximum 0.10% CVCM. Samples have been submitted for testing to Goddard Space Flight Center and other facilities, and the results are; Data Reference: GSC 17366; %TML: 0.94%; %CVCM: 0.06%

More Information
Part No. Price Order
115-2706 $16.50 Each
Harmonize Code: 3909.40.0000

To order click the "Order" button and follow the instructions. You may also order from distributors around the world.
Related Items/Included With
CircuitMedic Part
Bonding Iron, 120 VAC
Delivers the optimal heat for curing adhesive bonding film.
CircuitMedic Part
Bonding Iron, 230 VAC
Delivers the optimal heat for curing adhesive bonding film.
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