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115-1322 Circuit Bond Kit
Special Instructions
115-1322 Circuit Bond Kit
  1. The Circuit Bond Kit contains 10 packages of clear, low viscosity, superior strength epoxy, precisely measured out into two-compartment plastic packages.

  2. Circuit Bond is easy to use and there's no measuring.

  3. Has a working pot life of 30 minutes so it should not be mixed until ready to use.

  4. 115-1322 Circuit Bond Kit
    To use the Circuit Bond, remove the plastic clip separating the resin and hardener. Use the plastic clip to move the contents from one half of the package to the other. We recommend 50 - 100 strokes to thoroughly mix the contents. After mixing, cut a corner off the package and dispense the contents into a Plastic Cup. NOTE: The mixed epoxy may contain bubbles from the mixing process.

  5. Review the various Instruction Guides below for detailed step by step repair procedures.

Instruction Guides
The tools and materials included with the 115-1322 Circuit Bond Kit are used to complete the following.

2.4.1 Coating Replacement, Solder Mask
2.4.1 Coating Replacement, Solder Mask
Covers methods to replace solder mask.
2.4.3 Coating Replacement, Solder Mask, BGA Locations
2.4.3 Coating Replacement, Solder Mask, BGA Locations
Procedure covers methods to replace solder mask at BGA locations.
2.5 Baking and Preheating
2.5 Baking and Preheating
Covers baking and preheating of circuit boards.
2.7 Epoxy Mixing and Handling
2.7 Epoxy Mixing and Handling
Covers how to properly mixing and handling liquid epoxy used throughout these guides.
3.1 Delamination/Blister  Repair
3.1 Delamination/Blister Repair
Covers repair of blisters in circuit board base materials.
3.3.1 Hole Repair, Epoxy Method
3.3.1 Hole Repair, Epoxy Method
Covers how to repair minor damage to non-plated holes.
3.4.1 Key and Slot Repair, Epoxy Method
3.4.1 Key and Slot Repair, Epoxy Method
Covers how to repair minor damage to key and slot openings.
3.5.1 Base Material Repair, Epoxy Method
3.5.1 Base Material Repair, Epoxy Method
Covers how to repair minor damage to circuit base board material.
Circuit Bond Kit Includes

CircuitMedic Part
Circuit Bond Packs
Clear, superior strength epoxy in two-compartment plastic packages
CircuitMedic Part
Foam Swab
Ideal for absorbing cleaning solvents, and applying color agents and epoxies.
CircuitMedic Part
Micro Probes
Use to dispense a minute amount of adhesive and for micro-positioning of small objects.
CircuitMedic Part
Mixing Picks
Unique mixing sticks have a paddle shape on one and sharp pick on the opposite end.
CircuitMedic Part
Plastic Cup
Small disposable cup for mixing epoxies and holding small items.
CircuitMedic Part
Alcohol Swab
Self-saturating Isopropyl alcohol swab. Squeeze handle to release alcohol.