The Circuit Bonding System is ideal for replacing small surface mount and BGA pads.
Repair technicians appreciate the accuracy of this calibrated Bonding Press, especially when repairing surface mount and BGA pads. The press not only gives the operator better control over the bonding process, but also ensures optimal adhesion and repeatability. The Rework Stand has a built-in calibration slide to maintain a regulated bonding force depending upon the circuit pattern size and shape. A digital temperature controller maintains a uniform temperature throughout the 30-second bonding cycle.
Precision design for bonding of extremely small pads.
Heavy duty construction provides a stable platform.