CircuitMedic
First-Aid Kits for Circuit Boards ®
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Phone: 978-373-1600
115-3118 Bonding System
115-3118 Bonding System
The Circuit Bonding System is ideal for replacing small surface mount and BGA pads.
Repair technicians appreciate the accuracy of this calibrated Bonding Press, especially when repairing surface mount and BGA pads. The press not only gives the operator better control over the bonding process, but also ensures optimal adhesion and repeatability. The Rework Stand has a built-in calibration slide to maintain a regulated bonding force depending upon the circuit pattern size and shape. A digital temperature controller maintains a uniform temperature throughout the 30-second bonding cycle.
Features
Precision design for bonding of extremely small pads.
Heavy duty construction provides a stable platform.
Calibration gauge maintains regulated bonding force.
Temperature controller maintains uniform temperature.
Includes voltage converter for 120 VAC and 220 VAC.
1. Surface Mount Pad Repair - Quick Steps
Evaluate the damage and measure the pad length/width.
Select a replacement pad that matches the missing pad.
Cut out the replacement pad from the Circuit Frame.
Position the new pad using tape then bond in place.
Complete the connection to the existing conductor.
2. Land Repair - Quick Steps
Evaluate the damage and measure the land diameter.
Select a replacement land that matches the missing land.
Cut out the replacement land from the Circuit Frame.
Position the new land using tape then bond in place.
Complete the connection to the existing conductor.
3. Gold Edge Contact Repair - Quick Steps
Evaluate the damage and measure the contact length/width.
Select a replacement contact that matches the missing contact.
Cut out the replacement contact from the Circuit Frame.
Position the new contact using tape then bond in place.
Complete the connection to the existing conductor.
Specifications
Frame Construction11 gauge steel
Throat Depth12.0" (30.0 cm)
Throat Height7.0" (17.0 cm)
Vertical Travel7.0" (17.0 cm)
Weight10 lb. (4.5 kg.)
Power Input120/220 VACV
Temperature Controller RangeAmbient to 990 °F (871 °C)
Resolution1 °F (1 °C)
Cycle Time2 to 80 seconds
Power Consumption5 VA maximum
Heat Output20 Watts
Heat Up Time10 minutes

Ordering
Part No. Description Price 1-3 Price 4-7 Price 8-Up Order
115-3118 Bonding System $1995.00 $1915.00 $1850.00
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CircuitMedic
22 Parkridge Road, Haverhill, MA 01835 USA
Phone: 978-373-1600 - Fax: 978-372-5700
Division of Circuit Technology Center, Inc.
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