115-3118 Circuit Bonding System

The Circuit Bonding System is ideal for replacing small surface mount and BGA pads.
Repair technicians appreciate the accuracy of this calibrated Bonding Press, especially when repairing surface mount and BGA pads. The press not only gives the operator better control over the bonding process, but also ensures optimal adhesion and repeatability. The Rework Stand has a built-in calibration slide to maintain a regulated bonding force depending upon the circuit pattern size and shape. A digital temperature controller maintains a uniform temperature throughout the 30-second bonding cycle.

Applications
Features and Benefits
  • Precision design - permits bonding of minute patterns.
  • Heavy duty construction - ensures platform stability.
  • Built-in calibration slide maintains regulated bonding force.
  • Temperature controller maintains uniform bonding temperature for better results.

Specifications
Frame Construction 11 gauge steel
Throat Depth 12" (30.0 cm)
Throat Height 7" (17 cm)
Vertical Travel 7" (17 cm)
Weight 10 lb. (4.5 kg.)
Power Input 85 to 265 VDC/VAC
50 to 400 Hz 5 VA max.
Temperature Controller
   Range Ambient to 990F (871C
   Resolution 1F (1C)
Cycle Time 2 to 80 sec.
Power Consumption 5 VA max.
Heat Output 20 Watts
Heat Up Time 10 minutes

Ordering Information
  • Products may be ordered from distributors around the world. See our Distributor List.
  • To order online click the "Add to Cart" button and follow the on screen instructions.

Part No. Description Price Order
115-3118 Circuit Bonding System w/Temperature Controller, 120 VAC $2595.00
115-3119 Circuit Bonding System w/Fixed Temperature, 120 VAC 1595.00
115-3218 Circuit Bonding System w/Temperature Controller, 230 VAC 2595.00
115-3219 Circuit Bonding System w/Fixed Temperature, 230 VAC 1595.00

Web Page: http://www.circuitmedic.com/products/115-3118.shtml