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115-4100 Bonding System
115-4100 Bonding System
115-4100 Bonding System  
DETAILS  
Features
Precision design for bonding of extremely small pads.
Heavy duty construction provides a stable platform.
Calibration gauge maintains regulated bonding force.
Temperature controller maintains uniform temperature.
Includes 5 various Bonding Tips.

Description
You'll appreciate the accuracy of this calibrated Bonding Press, especially when repairing surface mount and BGA pads.

The press not only gives the operator better control over the bonding process, but also ensures optimal adhesion and repeatability.

115-4100 Bonding System
The system has a built-in calibration gauge to maintain a regulated bonding force and the digital temperature controller in the power unit base maintains a uniform temperature throughout the 30-second bonding cycle. Includes various Bonding Tips.
Instructions and more information.
Specifications
Frame ConstructionHeavy gauge aluminum and steel
Throat Depth260 mm
Throat Height100 mm
Vertical Travel100 mm
Weight10 lb. (4.5 kg.)
Power Input120 or 230 VAC
Temperature Controller Range200 °C to 480 °C
Resolution1 °C
Power Consumption45 Watts
Output Voltage24 VAC
Heat Up Time5 minutes
Ordering
Part No. Item Price Order
115-4100 Bonding System, 120 VAC $1995.00 Each
115-4102 Bonding System, 230 VAC $1995.00 Each
Harmonize Code: 8514.10.0000

To order click the "Order" button and follow the instructions. You may also order from distributors around the world.
Reference Procedures
4.5.2 Land Repair, Film Adhesive
4.6.2 Edge Contact Repair, Film Adhesive
4.7.2 Surface Mount Pad Repair, Film Adhesive
4.7.3 BGA Pad Repair, Film Adhesive
Questions?
If you have a question you can call 978-374-5000, or submit your question using the form below.

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