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201-1400 Land/Pad Repair Kit
Special Instructions
  1. 201-1400 Land/Pad Repair Kit
    This kit includes the tools and materials needed to reliably replace damaged lands, surface mount and BGA pads.

  2. The Bonding Iron will take 20 minutes to fully heat up. You should plug in the Bonding Iron at the start of the repair/rework procedure.

  3. The Bonding Iron operates at high temperature. Observe necessary precautions to prevent injury.

  4. When changing the Bonding Tip, allow 1 minute for tip temperature to stabilize.

  5. For detailed step by step procedures for repair of damaged lands and surface mount pads, see the Instruction Guides below.

Circuit Bond
  1. Circuit Bond is a clear, low viscosity, superior strength epoxy, precisely measured out into two-compartment plastic packages.

  2. Circuit Bond is easy to use and there's no measuring.

  3. Has a working pot life of 30 minutes so it should not be mixed until ready to use.

  4. 201-1400 Land/Pad Repair Kit
    To use Circuit Bond, remove the plastic clip separating the resin and hardener. Use the plastic clip to move the contents from one half of the package to the other. We recommend 50 - 100 strokes to thoroughly mix the contents. After mixing, cut a corner off the package and dispense the contents into a Plastic Cup. NOTE: The mixed epoxy may contain bubbles from the mixing process.

  5. Review the various Instruction Guides below for detailed step by step repair procedures.

Instruction Guides
The tools and materials included with the 201-1400 Land/Pad Repair Kit are used to complete the following.

4.1.1 Lifted Conductor Repair, Epoxy Seal Method
4.1.1 Lifted Conductor Repair, Epoxy Seal Method
Covers how to rebond a lifted conductor using liquid epoxy.
4.1.2 Lifted Conductor Repair, Film Adhesive
4.1.2 Lifted Conductor Repair, Film Adhesive
Covers how to rebond a lifted conductor using film adhesive.
4.4.1 Lifted Land Repair, Epoxy Seal
4.4.1 Lifted Land Repair, Epoxy Seal
Covers how to rebond a lifted land using liquid epoxy.
4.4.2 Lifted Land Repair, Film Adhesive
4.4.2 Lifted Land Repair, Film Adhesive
Covers how to rebond a lifted land using film adhesive.
4.5.1 Land Repair, Epoxy Method
4.5.1 Land Repair, Epoxy Method
Covers how to replace damaged lands using liquid epoxy.
4.5.2 Land Repair, Film Adhesive
4.5.2 Land Repair, Film Adhesive
Covers how to repair damaged lands using replacement lands and film adhesive.
4.7.1 Surface Mount Pad Repair, Adhesive Method
4.7.1 Surface Mount Pad Repair, Adhesive Method
Covers how to repair damaged surface mount pads using liquid adhesive.
4.7.2 Surface Mount Pad Repair, Film Adhesive
4.7.2 Surface Mount Pad Repair, Film Adhesive
Covers how to repair damaged pads using new pads and film adhesive.
4.7.3 BGA Pad Repair, Film Adhesive
4.7.3 BGA Pad Repair, Film Adhesive
Procedure to repair damaged BGA pads using new pads and film adhesive.
Land/Pad Repair Kit Includes

CircuitMedic Part
Abrader
Mild abrasive for removing oxides and contaminates from conductive surfaces.
CircuitMedic Part
Alcohol Swab
Self-saturating Isopropyl alcohol swab. Squeeze handle to release alcohol.
CircuitMedic Part
Bonding Iron, 120 VAC
Delivers the optimal heat for curing adhesive bonding film.
CircuitMedic Part
Bonding Tip, Tapered
Tip used to bond replacement conductors to circuit boards for repair.
CircuitMedic Part
Bonding Tip, .080" (2.03 mm) Diameter
Tip used to bond replacement conductors to circuit boards for repair.
CircuitMedic Part
Bonding Tip, .120" (3.05 mm) Diameter
Tip used to bond replacement conductors to circuit boards for repair.
CircuitMedic Part
Bonding Tip, .080" x .120" (2.03 mm x 3.05 mm)
Tip used to bond replacement conductors to circuit boards for repair.
CircuitMedic Part
Circuit Bond Packs
Clear, superior strength epoxy in two-compartment plastic packages
Circuit Frame
Circuit Frame CFV002AS
Replacement circuits with a dry-film adhesive backing.
Circuit Frame
Circuit Frame CFV003AS
Replacement circuits with a dry-film adhesive backing.
CircuitMedic Part
Cleaning Brushes
Disposable brushes for use with solvents for cleaning and application of coatings.
CircuitMedic Part
Foam Swab
Ideal for absorbing cleaning solvents, and applying color agents and epoxies.
CircuitMedic Part
High Temp Tape Discs
High temperature polyimide tape discs, .25" diameter.
CircuitMedic Part
High Temp Tape Discs
High temperature polyimide tape discs, .50" diameter.
CircuitMedic Part
Knife with #16 Blades
A must-have tool for precise cutting, scraping and trimming.
CircuitMedic Part
Measuring Microscope Pen, 25X
Pocket pen microscope with measuring reticle.
CircuitMedic Part
Micro Probes
Use to dispense a minute amount of adhesive and for micro-positioning of small objects.
CircuitMedic Part
Mixing Picks
Unique mixing sticks have a paddle shape on one and sharp pick on the opposite end.
CircuitMedic Part
Plastic Cup
Small disposable cup for mixing epoxies and holding small items.
CircuitMedic Part
Probe
Sharp dental style probe for manipulating small objects and removal of small debris.
CircuitMedic Part
Tweezer, Crossover
Self locking stainless steel tweezers provide hands-free clamping force.
CircuitMedic Part
Tweezer, Point Tip
Fine point tweezers for precision work.