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201-2400 Master Repair Kit
Special Instructions
  1. 201-2400 Master Repair Kit
    The Master Repair Kit includes dry film, adhesive-backed circuit frames for repair of lands and surface mount pads.

  2. The Bonding Iron will take 20 minutes to fully heat up. You should plug in the Bonding Iron at the start of the repair/rework procedure.

  3. The Bonding Iron operates at high temperature. Observe necessary precautions to prevent injury.

  4. When changing the Bonding Tip, allow 1 minute for tip temperature to stabilize.

  5. For detailed step by step procedures for repair of surface mount pads, edge contacts and conductors see the Instruction Guides below.

Circuit Bond
  1. Circuit Bond is a clear, low viscosity, superior strength epoxy, precisely measured out into two-compartment plastic packages.

  2. This epoxy is easy to use and there's no measuring.

  3. 201-2400 Master Repair Kit
    This adhesive has a working pot life of 30 minutes so it should not be mixed until ready to use.

  4. To use Circuit Bond Packs, remove the plastic clip separating the resin and hardener. Use the plastic clip to move the contents from one half of the package to the other. We recommend 50 - 100 strokes to thoroughly mix the contents. After mixing, cut a corner off the package and dispense the contents into a Plastic Cup. NOTE: The mixed epoxy may contain bubbles from the mixing process.

Instruction Guides
The tools and materials included with the 201-2400 Master Repair Kit are used to complete the following.

2.2.1 Cleaning, Local
2.2.1 Cleaning, Local
Covers localized cleaning of circuit board assemblies using a solvent.
2.4.1 Coating Replacement, Solder Mask
2.4.1 Coating Replacement, Solder Mask
Covers methods to replace solder mask.
2.7 Epoxy Mixing and Handling
2.7 Epoxy Mixing and Handling
Covers how to properly mixing and handling liquid epoxy used throughout these guides.
3.1 Delamination/Blister  Repair
3.1 Delamination/Blister Repair
Covers repair of blisters in circuit board base materials.
3.3.1 Hole Repair, Epoxy Method
3.3.1 Hole Repair, Epoxy Method
Covers how to repair minor damage to non-plated holes.
3.5.1 Base Material Repair, Epoxy Method
3.5.1 Base Material Repair, Epoxy Method
Covers how to repair minor damage to circuit base board material.
4.1.1 Lifted Conductor Repair, Epoxy Seal Method
4.1.1 Lifted Conductor Repair, Epoxy Seal Method
Covers how to rebond a lifted conductor using liquid epoxy.
4.1.2 Lifted Conductor Repair, Film Adhesive
4.1.2 Lifted Conductor Repair, Film Adhesive
Covers how to rebond a lifted conductor using film adhesive.
4.2.1 Conductor Repair, Foil Jumper
4.2.1 Conductor Repair, Foil Jumper
Covers how to repair a damaged conductor using a foil jumper.
4.2.2 Conductor Repair, Foil Jumper
4.2.2 Conductor Repair, Foil Jumper
Covers how to repair a damaged conductor using a foil jumper and film adhesive.
4.4.1 Lifted Land Repair, Epoxy Seal
4.4.1 Lifted Land Repair, Epoxy Seal
Covers how to rebond a lifted land using liquid epoxy.
4.4.2 Lifted Land Repair, Film Adhesive
4.4.2 Lifted Land Repair, Film Adhesive
Covers how to rebond a lifted land using film adhesive.
4.5.1 Land Repair, Epoxy Method
4.5.1 Land Repair, Epoxy Method
Covers how to replace damaged lands using liquid epoxy.
4.5.2 Land Repair, Film Adhesive
4.5.2 Land Repair, Film Adhesive
Covers how to repair damaged lands using replacement lands and film adhesive.
4.6.1 Edge Contact Repair, Adhesive Method
4.6.1 Edge Contact Repair, Adhesive Method
Covers how to repair damaged edge contacts using liquid adhesive.
4.6.2 Edge Contact Repair, Film Adhesive
4.6.2 Edge Contact Repair, Film Adhesive
Covers how to repair damaged edge contacts using new contacts and film adhesive.
4.7.1 Surface Mount Pad Repair, Adhesive Method
4.7.1 Surface Mount Pad Repair, Adhesive Method
Covers how to repair damaged surface mount pads using liquid adhesive.
4.7.2 Surface Mount Pad Repair, Film Adhesive
4.7.2 Surface Mount Pad Repair, Film Adhesive
Covers how to repair damaged pads using new pads and film adhesive.
4.7.3 BGA Pad Repair, Film Adhesive
4.7.3 BGA Pad Repair, Film Adhesive
Procedure to repair damaged BGA pads using new pads and film adhesive.
Master Repair Kit Includes

CircuitMedic Part
Abrader
Mild abrasive for removing oxides and contaminates from conductive surfaces.
CircuitMedic Part
Alcohol Swab
Self-saturating Isopropyl alcohol swab. Squeeze handle to release alcohol.
CircuitMedic Part
Bonding Film
Dry film adhesive used to bond lifted lands, pads and conductors.
CircuitMedic Part
Bonding Iron, 120 VAC
Delivers the optimal heat for curing adhesive bonding film.
CircuitMedic Part
Bonding Tip, Tapered
Tip used to bond replacement conductors to circuit boards for repair.
CircuitMedic Part
Bonding Tip, .080" (2.03 mm) Diameter
Tip used to bond replacement conductors to circuit boards for repair.
CircuitMedic Part
Bonding Tip, .120" (3.05 mm) Diameter
Tip used to bond replacement conductors to circuit boards for repair.
CircuitMedic Part
Bonding Tip, .120" x .500" (3.05 mm x 12.70 mm)
Tip used to bond replacement conductors to circuit boards for repair.
CircuitMedic Part
Circuit Board
Circuit board perfect for practice work.
CircuitMedic Part
Circuit Bond Packs
Clear, superior strength epoxy in two-compartment plastic packages
Circuit Frame
Circuit Frame CBLANKAS
Replacement circuits with a dry-film adhesive backing.
Circuit Frame
Circuit Frame CFV002AS
Replacement circuits with a dry-film adhesive backing.
Circuit Frame
Circuit Frame CFV003AS
Replacement circuits with a dry-film adhesive backing.
CircuitMedic Part
Circuit Track, .002" x .006"
Rectangular shaped pure copper wire used to repair damaged conductors.
CircuitMedic Part
Circuit Track, .002" x .010"
Rectangular shaped pure copper wire used to repair damaged conductors.
CircuitMedic Part
Circuit Track, .003" x .015"
Rectangular shaped pure copper wire used to repair damaged conductors.
CircuitMedic Part
Circuit Track, .005" x .030"
Rectangular shaped pure copper wire used to repair damaged conductors.
CircuitMedic Part
Cleaning Brushes
Disposable brushes for use with solvents for cleaning and application of coatings.
CircuitMedic Part
Color Agent, Green
Use to tint epoxy for solder mask and base board repair.
CircuitMedic Part
Color Agent, Light Green
Use to tint epoxy for solder mask and base board repair.
CircuitMedic Part
Foam Swab
Ideal for absorbing cleaning solvents, and applying color agents and epoxies.
CircuitMedic Part
High Temp Tape Discs
High temperature polyimide tape discs, .25" diameter.
CircuitMedic Part
High Temp Tape Discs
High temperature polyimide tape discs, .50" diameter.
CircuitMedic Part
Knife with #16 Blades
A must-have tool for precise cutting, scraping and trimming.
CircuitMedic Part
Measuring Microscope Pen, 25X
Pocket pen microscope with measuring reticle.
CircuitMedic Part
Micro Probes
Use to dispense a minute amount of adhesive and for micro-positioning of small objects.
CircuitMedic Part
Mixing Picks
Unique mixing sticks have a paddle shape on one and sharp pick on the opposite end.
CircuitMedic Part
Plastic Cup
Small disposable cup for mixing epoxies and holding small items.
CircuitMedic Part
Probe
Sharp dental style probe for manipulating small objects and removal of small debris.