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| Flextac BGA Rework Stencil Kit is packaged in a rugged ESD safe case. |
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Special FREE Offer (See Form
Below)
Complete Flextac
BGA Rework Stencil List
If you’ve been using metal stencils for
BGA rework, we have some great news for you. Flextac BGA Rework Stencils...a
creative new product that is a major improvement over what you maybe using now.
These flexible solder
paste stencils are laser cut from high quality, anti-static polymer film with a
residue-free adhesive backing. Because they are self-sticking, no tape or
fixturing is needed. The adhesive seals around each BGA pad to prevent solder
paste from bleeding under the stencil when the paste is applied. Flextac
Stencils are easy to use and leave no residue on the board surface.
Typical BGA rework stencils are made from metal and require
fixturing or taping to position them and hold them in place. Metal stencils warp
easily, and if the circuit board has undulations in the board surface, the metal
stencil will not sit flat. Since there is no gasket-like seal, solder paste can
easily bleed under metal stencils when paste is applied with a squeegee. Also
solder paste can spill out over the sides of flat metal stencils contaminating
the circuit board surface. Metal stencils require tedious stencil cleaning. To
use metal stencils effectively, a high level of operator skill is required.
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| The Kit includes 20 different sizes of BGA rework stencils, a spatula handle and three sizes of spatula blades. |
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How Flextac Stencils WorkYou first fold the pre-scored side
tabs and then peel off the protective cover film from the bottom side of the
stencil. Holds the side tabs while placing the Flextac Stencil in position on
the circuit board surface. If the stencil is not correctly positioned, you can
simply reposition it. The side tabs also serve as solder dams preventing solder
paste overspill. No external taping or fixturing is used. You next apply a small
dab of solder paste and uses a standard squeegee to spread the paste. Since the
residue-free adhesive seals around each BGA pad, you can make as many passes
with the squeege as needed to assure proper aperture filling. The Flextac
Stencil is then peeled up leaving a perfect deposit of solder on each pad.
Although Flextac Stencils are disposable, they can be used several times.
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| RoHS Compliant |
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Application
- Applying solder paste for BGA rework.
Features and
Benefits
- Residue-free adhesive backing seals around BGA pads to prevent solder paste
bleed.
- Laser cut ensures precise aperture size.
- Disposable - eliminates tedious stencil cleaning.
- Flexible - conforms to board surface.
- Fold-up sides for easy placement and solder paste containment.
- Low cost.
- Packaged in a handy ESD safe carrying case
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| Step 1: Select the proper size and fold up the side tabs. |
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| Step 2: Peel off the cover film exposing the adhesive backing. |
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| Step 3: Place in position using the handy side tabs. |
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| Step 4: Apply paste using a standard metal squeegee. |
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| Step 5: Remove the stencil and save for another reuse or dispose. |
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Ordering Information
Custom Patterns
| Part No. |
Description |
Price |
Order |
| 201-3120 |
Flextac BGA Rework Stencil Kit |
$199.00 |
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* Contact us for discount pricing information. Flextac BGA Rework Stencil Kit Includes