B4-104-1515-127 Flextac BGA Rework Stencil  


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Flextac Stencils are self-sticking solder paste stencils. These laser cut, polymer stencils use a full-release, residue-free adhesive similar to sticky notes. The self-sticking adhesive on the bottom of the stencil seals around each BGA pad to ensure that solder paste will not bleed under the stencil when the paste is applied. Disposable Flextac Stencils are easy to use and will not leave any residue on the board surface.

If you currently use metal stencils you need to fixture them or tape them in position to hold them in place. Metal stencils can warp, and if the circuit board has undulations in the board surface, the metal stencil will not sit flat. Since there is no gasket-like seal, solder paste can easily bleed under metal stencils when paste is applied with a squeegee. Also solder paste can spill out over the sides of flat stencils contaminating the circuit board surface.

More Information
Ordering Information
  • Flextac Stencils may be ordered from distributors around the world. See our Distributor List.
  • To order online click the "Order" button below and follow the on screen instructions.

US Patent number: 6,253,675
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Part No. Thickness Aperture Balls Ball Pattern Pitch Component Pkg./10 Order
B4-104-1515-127 004"
0.102 mm		 .024"
0.610 mm		 104 See Image .050"
1.27 mm		 15 mm x 15 mm $49.50
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