Imagine replacing damaged surface mount pads, lands and conductors without the mess of liquid epoxy, with a bond strength equal to the original, in just a few minutes.
Circuit Frames with dry-film adhesive backing make this delicate repair procedure easy, fast and highly reliable.
This reliable IPC recommended procedure meets the highest conformance level for this type of repair.
For over 30 years Circuit Frames have been used by thousands of commercial, medical and military manufacturers around the globe.
B-staged modified acrylic film adhesive .002" (.051 mm) thick.
Certification
Adhesive backing is certified to IPC-4203/18: Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Circuitry and Flexible Adhesive Bonding Films.
Solder Resistance
Passes IPC Spec 10 sec at 288°C (550°F).
Bonding Temperature
475°F ± 25°F (246°C ± 14°C)
Bonding Pressure
200 - 400 psi (14-28 kg/cm2)
Bonding Time
30 seconds
Peel Strength
Minimum 8 lbs/inch (1.43 kg/cm) after cure to FR-4 material.
Shelf Life
1 year minimum. Each Circuit Frame package is stamped with the expiration date.
Plating
.000050" (.00127 mm) Gold over .000100" (.00254 mm) Nickel
RoHS and REACH
CircuitMedic Circuit Frames contain less than 0.1% by weight any substance listed as a very high concern in Article 59 of REACH.
Outgassing
The Bonding Film used on Circuit Frames consistently meet the criteria for NASA applications. Maximum 1.0% TML and a Maximum 0.10% CVCM.
Samples have been submitted for testing to Goddard Space Flight Center and other facilities, and the results are; Data Reference: GSC 17366; %TML: 0.94%; %CVCM: 0.06%
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