CP070080AT Circuit Frame
Shown 2X Actual Size
|
Imagine replacing damaged circuits without the mess of liquid epoxy, with a bond strength equal to the original, on bare
or loaded circuit boards -- all in about 30 seconds. Our replacement Circuit Frames with dry-film adhesive backing make
this delicate, precise procedure quick and neat. Trim out the circuit you need and bond it to the circuit
board surface with a bonding iron or bonding press.
| Overall Frame Size |
2.25" x 1.50" (57 x 38 mm) |
| Base Material |
Rolled annealed copper foil .0014" (.036 mm)
thick. |
| Adhesive Backing |
Phenolic Butral film adhesive .0018" (.046 mm)
thick. |
| Bonding Temperature |
475°F ± 25°F (246°C ± 14°C) |
| Bonding Time |
30 seconds |
| Peel Strength |
Minimum 8 lbs/inch (1.43 kg/cm) after cure to FR-4
material. |
| Shelf Life |
6 months minimum. Each Circuit Frame is stamped with
the
expiration date. |
| Plating Options * |
- Tin/Lead - .0005" (.0127 mm) 60/40 Tin/Lead minimum.
- Bright Tin (Lead Free) - .0005" Tin (.0127 mm) minimum.
- Nickel/Gold - Gold .000050" (.00127 mm) minimum over Nickel .000100" (.00254
mm) minimum.
Note: Tin/Lead Circuit Frames have a minimum 12 piece order and five week lead time.
|
Ordering Information
| Part No. |
Description |
Plating * |
Bonding Tip |
Load |
Price Each |
Order |
| CP070080AT |
Lands .070"/.080" (1.78 mm/2.03 mm) |
Tin/Lead |
115-2204 |
C |
$39.00 |
|
Freight, duties, and value added taxes may increase prices for products outside USA.
Web Page: http://www.circuitmedic.com/products/CP070080AT.shtml
