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CS040110AT Circuit Frame

Surface Mount Pads .040" x .110" (1.016 mm x 2.794 mm)
CS040110AT
Shown Slightly Enlarged
Imagine replacing damaged surface mount pads, lands and conductors without the mess of liquid epoxy, with a bond strength equal to the original, in just a few minutes.

Circuit Frames with dry-film adhesive backing make this delicate repair procedure easy, fast and highly reliable.

This reliable IPC recommended procedure meets the highest conformance level for this type of repair. For over 30 years Circuit Frames have been used by thousands of commercial, medical and military manufacturers around the globe.
Overall Frame Size 2.25" x 1.50" (57 x 38 mm)
Base Material Rolled annealed copper foil .0014" (.036 mm) thick.
Adhesive Backing B-staged modified acrylic film adhesive .002" (.051 mm) thick.
Certification Adhesive backing is certified to IPC-4203/18: Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Circuitry and Flexible Adhesive Bonding Films.
Solder Resistance Passes IPC Spec 10 sec at 288°C (550°F).
Bonding Temperature 475°F ± 25°F (246°C ± 14°C)
Bonding Pressure 200 - 400 psi (14-28 kg/cm2)
Bonding Time 30 seconds
Peel Strength Minimum 8 lbs/inch (1.43 kg/cm) after cure to FR-4 material.
Shelf Life 1 year minimum. Each Circuit Frame package is stamped with the expiration date.
Plating .0001" (.0025 mm) 63/37 Tin/Lead
RoHS and REACH CircuitMedic Circuit Frames contain less than 0.1% by weight any substance listed as a very high concern in Article 59 of REACH.
Outgassing The Bonding Film used on Circuit Frames consistently meet the criteria for NASA applications. Maximum 1.0% TML and a Maximum 0.10% CVCM. Samples have been submitted for testing to Goddard Space Flight Center and other facilities, and the results are; Data Reference: GSC 17366; %TML: 0.94%; %CVCM: 0.06%
Compliance IPC4562A and IPC4562/7
Ordering Information
bullet   See the full list of Circuit Frames.
bullet   Circuit Frames may be ordered from distributors around the world. See our Distributor List.
bullet   To order online click the "Order" button and follow the on screen instructions.
bullet   Harmonize Code:7410.21.6000

Description: Surface Mount Pads .040" x .110" (1.016 mm x 2.794 mm)
Plating: Tin/Lead
RoHS Compliant: Non Compliant

Part No. Price Order
CS040110AT $44.00 Each
Optional Items
Part No. Price Order
image
115-3102 Bonding Iron, 120 VAC
Delivers the optimal heat for curing adhesive bonding film.
$109.00 Each
image
115-2104 Bonding Tip, Tapered
Tip used to bond replacement conductors to circuit boards for repair.
$45.00 Each
image
115-2204 Bonding Tip, .080" (2.03 mm) Diameter
Tip used to bond replacement conductors to circuit boards for repair.
$45.00 Each
image
115-2206 Bonding Tip, .120" (3.05 mm) Diameter
Tip used to bond replacement conductors to circuit boards for repair.
$45.00 Each
image
115-2306 Bonding Tip, .040" x .060" (1.02 mm x 1.52 mm)
Tip used to bond replacement conductors to circuit boards for repair.
$45.00 Each
image
115-2316 Bonding Tip, .080" x .120" (2.03 mm x 3.05 mm)
Tip used to bond replacement conductors to circuit boards for repair.
$45.00 Each

Freight, duties, and value added taxes may increase prices for products outside USA.
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