Circuit Frames

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1. Remove the damaged pads and prepare the area.

Imagine replacing damaged circuits without the mess of liquid epoxy, with a bond strength equal to the original, on bare or loaded circuit boards -- all in about 30 seconds. Our replacement Circuit Frames with dry-film adhesive backing make this delicate, precise procedure quick and neat. Trim out the circuit you need and bond it to the circuit board surface with a bonding iron or bonding press.

Choose from hundreds of different shapes or let us custom design and fabricate that special shape for you.

Replacing circuits and pads is done in 4 steps.

Step 1 (See Figure 1.)

2. Select a replacement pad and trim it out from the Circuit Frame.

Evaluate the damaged circuits. If the base material is severely damaged it may have to first be repaired using epoxy. See Base Board Repair Kit. Remove the defective pad or conductor and scrape off any soldermask from the connecting circuit. Apply liquid flux to the connecting circuit on the board surface and tin with solder.

Step 2 (See Figure 2.)
Select a replacement pad that matches the missing pad. Scrape off the adhesive bonding film from the solder joint area on the back of new pad. Trim out the new pad from the Circuit Frame. Cut from the plated side.

3. Place the pad in position using tape and bond in place.

Step 3 (See Figure 3.)
Temporarily place the new pad in position using Kapton tape. Then permanently bond the new pad using the Bonding System or Bonding Iron. Bonding time is only 30 seconds.

4. Complete the connection to the existing circuit.

Step 4 (See Figure 4.)
If the new conductor has a connecting circuit, apply liquid flux to the lap solder joint connection area and solder the circuit of the new pad to the circuit on the printed circuit board surface. If desired, apply epoxy to the lap solder joint connection.

Specifications

Overall Frame Size	2.25" x 1.50" (57 x 38 mm)
Base Material	Rolled annealed copper foil .0014" (.036 mm) thick.
Adhesive Backing	Phenolic Butral film adhesive .0018" (.046 mm) thick.
Bonding Temperature	475°F ± 25°F (246°C ± 14°C)
Bonding Time	30 seconds
Peel Strength	Minimum 8 lbs/inch (1.43 kg/cm) after cure to FR-4 material.
Shelf Life	6 months minimum. Each Circuit Frame is stamped with the expiration date.
Plating Options * See Plating callout    in table below.	Tin/Lead - .0005" (.0127 mm) 60/40 Tin/Lead minimum. Bright Tin (Lead Free) - .0005" Tin (.0127 mm) minimum. Nickel/Gold - Gold .000050" (.00127 mm) minimum over Nickel .000100" (.00254 mm) minimum.

Dry Film Adhesive Backing - Part No. 115-2706 The dry film adhesive backing is available separately. Each piece is 2.25" x 1.50" (57 x 38 mm) and Price is $16.50 each.