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Complete Flextac BGA Rework Stencil List

If you’ve been using metal stencils for BGA rework, we have some great news for you. Flextac BGA Rework Stencils...a creative new product that is a major improvement over what you maybe using now.

Flextac BGA Rework Stencil Kit is packaged in a rugged ESD safe case.

These flexible solder paste stencils are laser cut from high quality, anti-static polymer film with a residue-free adhesive backing. Because they are self-sticking, no tape or fixturing is needed. The adhesive seals around each BGA pad to prevent solder paste from bleeding under the stencil when the paste is applied. Flextac Stencils are easy to use and leave no residue on the board surface.

Typical BGA rework stencils are made from metal and require fixturing or taping to position them and hold them in place. Metal stencils warp easily, and if the circuit board has undulations in the board surface, the metal stencil will not sit flat. Since there is no gasket-like seal, solder paste can easily bleed under metal stencils when paste is applied with a squeegee. Also solder paste can spill out over the sides of flat metal stencils contaminating the circuit board surface. Metal stencils require tedious stencil cleaning. To use metal stencils effectively, a high level of operator skill is required.

The Kit includes 20 different sizes of BGA rework stencils, a spatula handle and three sizes of spatula blades.

How Flextac Stencils Work
You first fold the pre-scored side tabs and then peel off the protective cover film from the bottom side of the stencil. Holds the side tabs while placing the Flextac Stencil in position on the circuit board surface. If the stencil is not correctly positioned, you can simply reposition it. The side tabs also serve as solder dams preventing solder paste overspill. No external taping or fixturing is used. You next apply a small dab of solder paste and uses a standard squeegee to spread the paste. Since the residue-free adhesive seals around each BGA pad, you can make as many passes with the squeege as needed to assure proper aperture filling. The Flextac Stencil is then peeled up leaving a perfect deposit of solder on each pad. Although Flextac Stencils are disposable, they can be used several times.

RoHS Compliant

Application

• Applying solder paste for BGA rework.

• Residue-free adhesive backing seals around BGA pads to prevent solder paste bleed.
• Laser cut ensures precise aperture size.
• Disposable - eliminates tedious stencil cleaning.
• Flexible - conforms to board surface.
• Fold-up sides for easy placement and solder paste containment.
• Low cost.
• Packaged in a handy ESD safe carrying case

Step 1: Select the proper size and fold up the side tabs.

Step 2: Peel off the cover film exposing the adhesive backing.

Step 3: Place in position using the handy side tabs.

Step 4: Apply paste using a standard metal squeegee.

Step 5: Remove the stencil and save for another reuse or dispose.

• Products may be ordered from distributors around the world. See our Distributor List.
• See the full list of available stencils.
• To order online click the "Order" button and follow the on screen instructions.

• See the full list of available stencils before requesting a custom stencil.
• A custom pattern can be made for most BGA components.
• Complete the Flextac BGA Rework Stencil Custom Requerst Form and we will provide you with price and delivery information.