B6-005-1116-254 Flextac BGA Rework Stencil

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Flextac Stencils are self-sticking solder paste stencils. These laser cut, polymer stencils use a full-release, residue-free adhesive similar to sticky notes. The self-sticking adhesive on the bottom of the stencil seals around each BGA pad to ensure that solder paste will not bleed under the stencil when the paste is applied. Disposable Flextac Stencils are easy to use and will not leave any residue on the board surface.

If you currently use metal stencils you need to fixture them or tape them in position to hold them in place. Metal stencils can warp, and if the circuit board has undulations in the board surface, the metal stencil will not sit flat. Since there is no gasket-like seal, solder paste can easily bleed under metal stencils when paste is applied with a squeegee. Also solder paste can spill out over the sides of flat stencils contaminating the circuit board surface.

More Information

• See Flextac BGA Rework Stencil Kit
• See Full Flextac BGA Rework Stencil Selection

Ordering Information

• Flextac Stencils may be ordered from distributors around the world. See http://www.circuitmedic.com/products/distributors.shtml.
• To order online click the "Order" button below and follow the on screen instructions.

Part No.	Thickness	Aperture	Balls	Ball Pattern	Pitch	Component	Pkg./10	Order
B6-005-1116-254	.006" 0.152 mm	.060" 1.524 mm	5	1 x 5 Array	.100" 2.54 mm	11 mm x 16 mm	$49.50

Freight, duties, and value added taxes may increase prices for products outside USA.

Web Page: http://www.circuitmedic.com/products/B6-005-1116-254.shtml