CircuitMedic
First-Aid Kits for Circuit Boards ®
www.circuitmedic.com
Haverhill, MA 01835 USA
A Circuit Technology Center Company
Circuit Frames

Imagine replacing damaged surface mount pads, lands, and conductors without using messy liquid epoxy, with bond strength equal to the original, in just a few minutes.

Circuit Frames with dry-film adhesive backing make this IPC-recommended procedure fast and easy, meeting the highest conformance level.


Base Material Specifications
Overall Frame Size 2.25" x 1.50" (57 x 38 mm)
Base Material Rolled annealed copper foil .0014" (.036 mm) thick.
Plating .0001" (.0025 mm) Bright Tin (Lead-Free), RoHS Compliant
Surface Treatments Top side plated. The bottom side is treated to promote adhesion.
Shelf Life Shelf life of base material without adhesive application is unlimited.
RoHS and REACH CircuitMedic Circuit Frames contain less than 0.1% by weight of any substance listed as a very high concern in Article 59 of REACH.


Adhesive Backing Specifications
Adhesive Backing Optional adhesive backing film is applied using a quick-bond process that retains B-staged adhesive properties.
Adhesive Material B-staged modified acrylic film adhesive .002" (.051 mm) thick.
Certification Adhesive backing is certified to IPC-4203/18: Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Circuitry and Flexible Adhesive Bonding Films.
Solder Resistance Passes IPC Spec 10 sec at 288°C (550°F).
Bonding Temperature 475°F ± 25°F (246°C ± 14°C)
Bonding Pressure 200 - 400 psi (14-28 kg/cm2)
Bonding Time 30 seconds
Peel Strength Minimum 8 lbs/inch (1.43 kg/cm) after curing to FR-4 material.
Outgassing The Bonding Film used on Circuit Frames consistently meets the criteria for NASA applications. Maximum 1.0% TML and a Maximum 0.10% CVCM. Samples have been submitted for testing to Goddard Space Flight Center and other facilities, and the results are; Data Reference: GSC 17366; %TML: 0.94%; %CVCM: 0.06%
Shelf Life One year minimum. Each Circuit Frame package is stamped with the expiration date. The adhesive material is sensitive to light and heat. Store in a dark or refrigerated environment to preserve the shelf life.


Circuit Frame Plating Options
Bright Tin .0001" (.0025 mm) Bright Tin (Lead-Free), RoHS Compliant
Tin/Lead .0001" (.0025 mm) 63/37 Tin/Lead, Non RoHS Compliant
Nickel/Gold .000050" (.00127 mm) Gold over .000100" (.00254 mm) Nickel, RoHS Compliant
CircuitMedic
First-Aid Kits for Circuit Boards ®
www.circuitmedic.com
Haverhill, MA 01835 USA
A Circuit Technology Center Company
Circuit Frames

Visit the follow pages for details instructions.

Instructions and Procedures
Guide Page
4.1.2 Lifted Conductor Repair, Film Adhesive Method www.circuitrework.com/guides/4-1-2.html
4.2.2 Conductor Repair, Foil Jumper, Film Adhesive Method www.circuitrework.com/guides/4-2-2.html
4.2.7 Conductor Repair, Surface Plane, Film Adhesive Method www.circuitrework.com/guides/4-2-7.html
4.5.1 Land Repair, Epoxy Method www.circuitrework.com/guides/4-5-1.html
4.5.2 Land Repair, Film Adhesive Method www.circuitrework.com/guides/4-5-2.html
4.6.1 Edge Contact Repair, Epoxy Method www.circuitrework.com/guides/4-6-1.html
4.6.2 Edge Contact Repair, Film Adhesive Method www.circuitrework.com/guides/4-6-2.html
4.7.1 Surface Mount Pad Repair, Epoxy Method www.circuitrework.com/guides/4-7-1.html
4.7.2 Surface Mount Pad Repair, Film Adhesive Method www.circuitrework.com/guides/4-7-2.html
4.7.3 Surface Mount, BGA Pad Repair, Film Adhesive Method www.circuitrework.com/guides/4-7-3.html
4.7.4 Surface Mount, BGA Pad with Integral Via Repair www.circuitrework.com/guides/4-7-4.html
4.7.5 Surface Mount, BGA Pad, Integral Via, Circuit Extension Method www.circuitrework.com/guides/4-7-5.html
6.2.1 Jumper Wires, BGA Components, Circuit Track Method www.circuitrework.com/guides/6-2-1.html
6.2.2 Jumper Wires, BGA Components, Through Board Method www.circuitrework.com/guides/6-2-2.html