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The system has a built-in force gauge to maintain a regulated bonding force and a digital temperature controller to maintain a uniform temperature throughout the 30-second replacement circuit bonding cycle. Circuit Frames are available in hundreds of shapes, including lands, pads, and edge contacts. See www.circuitmedic.com/products/circuitframes.html. Setup
Operation
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Bonding Force is the force applied to the top surface of replacement pads, lands, or conductors during the cure cycle. The recommended Bonding Force for Circuit Frames is 200 - 400 psi.
Digital Force Gauge Calibration
Visit www.circuitrework.com/guidebook for details instructions.
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