This Bonding System is a precision machine using heated Bonding Tips that deliver a calibrated pressure to bond adhesive-back Circuit Frames to circuit boards.

The system has a built-in force gauge to maintain a regulated bonding force and a digital temperature controller to maintain a uniform temperature throughout the 30-second replacement circuit bonding cycle.

Circuit Frames are available in hundreds of shapes, including lands, pads, and edge contacts.
See www.circuitmedic.com/products/circuitframes.html.

Setup

1. Unpack the system and place the stand on a workbench.
2. Connect the Force Gauge to the mounting plate using the (4) Thumb Screws.
3. If the system will be used extensively, plug the Power Adapter into the Force Gauge.
4. Connect the Bonding System Heater to the Force Gauge and lock it in place using the #10-32 Nut included with the Bonding System Heater.
5. Secure the Force Gauge Power Adapter and Bonding System Heater power cords to the side of the stand using the #10-32 Button Head Screw and Cable Clips.
6. To set the Bonding System Heater temperature, press and hold the red button until the temperature indicator turns on. Pressing the heat up or heat down buttons can change the set temperature.

Operation

1. See the Reference Guide Procedures for detailed preparation and process instructions.
2. Turn on the Bonding System Heater and set the temperature to 475° F +/- 25° F (246° C +/- 14° C).
3. Turn on the Force Gauge and zero the reading.
4. Position the circuit board on the Flex-Rack PCB Holder. Test the alignment by turning the handle to lower the Bonding Tip until it nearly touches the surface. Check to be sure the bottom of the Bonding Tip is parallel to the surface of the circuit board.
5. Rotate the hand wheel on the stand base to apply the force required.