First-Aid Kits for Circuit Boards ®
Haverhill, MA 01835 USA
A Circuit Technology Center Company
Tools and Materials
Qty Part No. Description
1 115-3108 Practice Circuit Board
1 115-3136 Abrader
2 115-3302 Circuit Bond Epoxy
Pkg/5 115-3312-5 Plastic Cup
Pkg/5 115-3315-5 Mixing Picks
1 115-5210 Circuit Track, .002" x .010"
1 115-5520 Circuit Track, .005" x .020"
Pkg/25 115-7306-25 Eyelet, Flat Flange
Pkg/25 115-7456-25 Eyelet, Flat Flange
1 115-9348 Color Agent, Green
Pkg/5 235-2102-5 Foam Swab, Small
Pkg/5 235-2106-5 Cleaning Brushes
Pkg/5 235-2108-5 Foam Swab, Large
Pkg/60 235-3050 High Temp Tape Discs
1 355-0614 Knife with #16 Blades
Pkg/5 355-3102-5 Micro Probes
1 525-2101-1 Circuit Frame, Assortment, Bright Tin Plated
201-4350 Repair Skills Practice Kit

This kit will help operators improve their circuit board repair skills and give them an advantage toward becoming IPC certified.

Includes a circuit board with various plated holes, surface mount pads, replacement circuit tracks, eyelets, adhesives, and more.

The Repair Skills Practice Kit will help operators brush up on their circuit board repair skills.
Includes dry film, adhesive-backed replacement circuits that do not use messy liquid epoxy.
Includes Circuit Tracks to repair damaged circuits.
Includes adhesives and color agents for solder mask or base board repair.
Includes eyelets for plated through hole repair.
Every item is prime quality, time-tested, to meet high standards.
Tools and materials conform to IPC guidelines.

Visit the follow pages for details instructions.
Instructions and Procedures
Guide Page
2.4.1 Coating Replacement, Solder Mask
2.7 Epoxy Mixing and Handling
3.5.1 Base Material Repair, Epoxy Method
4.2.1 Conductor Repair, Foil Jumper, Epoxy Method
4.4.1 Lifted Land Repair, Epoxy Seal Method
4.4.2 Lifted Land Repair, Film Adhesive Method
4.5.1 Land Repair, Epoxy Method
4.5.2 Land Repair, Film Adhesive Method
4.6.1 Edge Contact Repair, Epoxy Method
4.6.2 Edge Contact Repair, Film Adhesive Method
4.7.1 Surface Mount Pad Repair, Epoxy Method
4.7.2 Surface Mount Pad Repair, Film Adhesive Method
4.7.3 Surface Mount, BGA Pad Repair, Film Adhesive Method
5.1 Plated Hole Repair, No Inner Layer Connection